Inventor · disambiguated record
Yukio Arimitsu
Also filed as: ARIMITSU YUKIO
20 granted patents·25 pending applications·196 citations·filing 2001–2019
94Inventor score
Top patents by PatentIndex Score
45 records- 0189US6998175B2Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2001·Granted Feb 14, 2006·42 cites·11 claims
- 0287US7635516B2Heat-peelable pressure-sensitive adhesive sheet and method for processing adherend using the heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2005·Granted Dec 22, 2009·17 cites·11 claims
- 0386US6488803B2Radiation-curable heat-peelable pressure-sensitive adhesive sheet and process for producing cut pieces with the sameNITTO DENKO CORP·Filed 2001·Granted Dec 3, 2002·37 cites·6 claims
- 0484US8436481B2Heat-resistant adhesive sheet for substrateless semiconductor package fabrication and method for fabricating substrateless semiconductor package using the adhesive sheetHOSHINO SHINJI·Filed 2010·Granted May 7, 2013·11 cites·6 claims
- 0584US7811647B2Heat-peelable pressure-sensitive adhesive sheet and method for processing adherend using the heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2005·Granted Oct 12, 2010·11 cites·9 claims
- 0682US7175728B2Heat-peelable adhesive sheetNITTO DENKO CORP·Filed 2005·Granted Feb 13, 2007·7 cites·4 claims
- 0780US7641760B2Method of thermal adherend release and apparatus for thermal adherend releaseNITTO DENKO CORP·Filed 2005·Granted Jan 5, 2010·9 cites·11 claims
- 0878US7718257B2Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2001·Granted May 18, 2010·14 cites·6 claims
- 0978US7691225B2Thermal-release double-coated pressure-sensitive adhesive tape or sheet and method of processing adherendNITTO DENKO CORP·Filed 2008·Granted Apr 6, 2010·7 cites·18 claims
- 1071US7163597B2Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2003·Granted Jan 16, 2007·14 cites·4 claims
- 1163US7067030B2Heat-peelable adhesive sheetNITTO DENKO CORP·Filed 2003·Granted Jun 27, 2006·7 cites·6 claims
- 1261US7029550B2Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the sameNITTO DENKO CORORATION·Filed 2001·Granted Apr 18, 2006·8 cites·7 claims
- 1359US2016254559A1Pressure-sensitive adhesive sheet for conveying electrolyte membrane and method using said pressure-sensitive adhesive sheet to manufacture fuel-cell membrane electrode assemblyNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 1458US9120955B2Double-sided adhesive tape or sheet, and adherend processing methodARIMITSU YUKIO·Filed 2012·Granted Sep 1, 2015·1 cites·7 claims
- 1558US7214424B2Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2002·Granted May 8, 2007·6 cites·10 claims
- 1656US8409884B2Process for producing organic electroluminescent panelHIRAYAMA TAKAMASA·Filed 2009·Granted Apr 2, 2013·1 cites·6 claims
- 1756US2010119757A1Heat-peelable double-sided pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 1856US2010119816A1Heat-peelabe pressure-sensitive adhesive sheet containing layered silicate and process for the production for electronic components by the use of the sheetNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 1955US2016285120A1Method for manufacturing fuel-cell membrane electrode assemblyNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 2054US11338233B2Air filter medium, filter pleat pack, and air filter unitNITTO DENKO CORP·Filed 2018·Granted May 24, 2022·0 cites·8 claims
- 2154US7147743B2Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the sameNITTO DENKO CORP·Filed 2001·Granted Dec 12, 2006·4 cites·7 claims
- 2250US8475600B2Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatusUENDA DAISUKE·Filed 2006·Granted Jul 2, 2013·0 cites·9 claims
- 2350US2021252445A1Air filter unit and air conditionerNITTO DENKO CORP·Filed 2019·Application pending·0 cites
- 2450US2007111392A1Method for thermally releasing chip cut piece from thermal release type pressure sensitive adhesive sheet, electronic component and circuit boardNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 2549US2008038540A1Adhesive sheet, process for producing the same, and method of cutting multilayered ceramic sheetNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 2649US2008008831A1Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 2749US2008073034A1Method for thermally releasing adherend and apparatus for thermally releasing adherendNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 2848US8524007B2Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatusUENDA DAISUKE·Filed 2010·Granted Sep 3, 2013·0 cites·8 claims
- 2945US2010215882A1Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheetNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 3044US2011200744A1Adhesive sheet, process for producing the same, and method of cutting multilayered ceramic sheetNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 3143US2010119791A1Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 3243US2011094675A1Electronic paper manufacturing method and double-sided adhesive tape for electronic paper formation processNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 3341US2005136251A1Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2004·Application pending·0 cites
- 3440US2004177918A1Method of heat-peeling chip cut pieces from heat peel type adhesive sheet, electronic part, and circuit boardFiled 2002·Application pending·0 cites
- 3539US2013186565A1Polymer for pressure sensitive adhesive, pressure sensitive adhesive composition and heat-peelable pressure sensitive adhesive sheetNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 3639US2013344274A1Pressure-sensitive adhesive tape for protecting surface of semiconductor partsFUKUHARA JUNJI·Filed 2012·Application pending·0 cites
- 3738US2005236107A1Method of thermal adherend release and apparatus for thermal adherend releaseNITTO DENKO CORP·Filed 2005·Application pending·0 cites
- 3838US2013237017A1Pressure-sensitive adhesive tape for resin encapsulation and method for producing resin encapsulation type semiconductor deviceKONDO HIROYUKI·Filed 2012·Application pending·0 cites
- 3937US2012222805A1Tackiness adhesive sheet for thin-film substrate fixingSHINTANI TOSHIO·Filed 2012·Application pending·0 cites
- 4037US2002195199A1Method for thermally releasing adherend and apparatus for thermally releasing adherendNITTO DENKO CORP·Filed 2002·Application pending·0 cites
- 4136US2012223455A1Method for manufacturing thin-film substrateSHINTANI TOSHIO·Filed 2012·Application pending·0 cites
- 4234US2013244377A1Heat-resistant pressure-sensitive adhesive tape for production of semiconductor device and method for producing semiconductor device using the tapeARIMITSU YUKIO·Filed 2012·Application pending·0 cites
- 4333US2013335879A1Double-sided adhesive tape or sheet, and adherend processing methodARIMITSU YUKIO·Filed 2012·Application pending·0 cites
- 4428US8524361B2Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheetSOEJIMA KAZUKI·Filed 2010·Granted Sep 3, 2013·0 cites·15 claims
- 4528US2013251985A1LaminateNAKANISHI TADATOSHI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →