Inventor · disambiguated record
Yu-Hao Chen
Also filed as: CHEN YU · CHEN YU-HAO
42 granted patents·37 pending applications·393 citations·filing 1997–2025
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD45MPI CORP10INST INFORMATION IND3APEX MEDICAL CORP2INST INFORMATION INDUSTRY2
Top patents by PatentIndex Score
79 records- 0197US11967591B2Info packages including thermal dissipation blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 23, 2024·4 cites·20 claims
- 0296US11688725B2Semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 27, 2023·2 cites·20 claims
- 0396US5968610AMulti-step high density plasma chemical vapor deposition processUNITED MICROELECTRONICS CORP·Filed 1997·Granted Oct 19, 1999·371 cites·22 claims
- 0495US11609374B2Directionally tunable optical reflectorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 21, 2023·2 cites·20 claims
- 0587US10466199B2Biosensor deviceUNIV NAT TAIWAN·Filed 2016·Granted Nov 5, 2019·4 cites·20 claims
- 0686US12085769B2Integrated circuit device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 10, 2024·1 cites·20 claims
- 0786US2025347862A1Method of making semiconductor device including optical through via and method of usingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0885US12271029B2Directionally tunable optical reflectorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Apr 8, 2025·0 cites·20 claims
- 0984US2025132268A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1083US11233039B2Semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 25, 2022·1 cites·20 claims
- 1183US2025341544A1Probe card, method for designing probe card, connection carrier boaed, method for producing tested semiconductor device, method for testing unpackaged semiconductor by probe card, device under test and probe systemMPI CORP·Filed 2025·Application pending·0 cites
- 1282US12512419B2Method of fabricating memory device and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 1382US12368148B2Info packages including thermal dissipation blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
- 1482US12300684B2Semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 1582US12218082B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
- 1682US2025259977A1Semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1782US2025309218A1Info packages including thermal dissipation blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1881US11994713B2Directionally tunable optical reflectorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 28, 2024·0 cites·20 claims
- 1981US11150510B2Backlight module and display terminalQINGDAO HISENSE ELECTRONICS CO LTD·Filed 2019·Granted Oct 19, 2021·2 cites·16 claims
- 2081US2025093765A1Methods for making semiconductor-based integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2181US2025216605A1Directionally tunable optical reflectorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2280US12197123B2Methods for making semiconductor-based integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 2380US12181722B2Structures and process flow for integrated photonic-electric ic package by using polymer waveguideTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
- 2480US12159791B2Info packages including thermal dissipation blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 3, 2024·0 cites·20 claims
- 2580US2025130379A1Structures and process flow for integrated photonic-electric ic package by using polymer waveguideTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2680US2024393368A1Probe system for testing of devices under test integrated on a semiconductor wafer, and probe card, probe head, and guiding plate structure thereinMPI CORP·Filed 2024·Application pending·0 cites
- 2780US2025364358A1Device level thermal dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2880US2025054775A1Info packages including thermal dissipation blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2980US2024393367A1Probe system for testing of devices under test integrated on a semiconductor wafer, and probe card, probe head, and guiding plate structure thereinMPI CORP·Filed 2024·Application pending·0 cites
- 3078US2024371839A1Heat Dissipation in Semiconductor Packages and Methods of Forming SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3178US2025349804A1Semiconductor structure with integrated passive device having opposed solder bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3277US12074148B2Heat dissipation in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 27, 2024·0 cites·20 claims
- 3376US2024345425A1Semiconductor device manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3475US2025298196A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3575US2024361546A1Integrated circuit device manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3674US2023384537A1Method of making semiconductor device including optical through via and method of usingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3773US12392803B2Probe card, method for designing probe card, method for producing tested semiconductor device method for testing unpackaged semiconductor by probe card, device under test and probe systemMPI CORP·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 3873US11855006B2Memory device, package structure and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·17 claims
- 3972US11817324B2Info packages including thermal dissipation blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 14, 2023·0 cites·20 claims
- 4072US11754794B2Semiconductor device including optical through via and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 4171US2023389428A1Method of manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4270US12360321B2Package structure, semiconductor device and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 4370US11852967B2Methods for making semiconductor-based integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 4470US11740415B2Structures and process flow for integrated photonic-electric IC package by using polymer waveguideTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 4568US11527518B2Heat dissipation in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 13, 2022·0 cites·20 claims
- 4666US12055800B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 6, 2024·0 cites·20 claims
- 4766US12029123B2Semiconductor structure and method of manufacturing a semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 2, 2024·0 cites·19 claims
- 4864US2023387078A1Semiconductor structure with integrated passive device having opposed solder bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4964US2023031333A1Device level thermal dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 5063US10983379B2Display deviceHISENSE VISUAL TECH CO LTD·Filed 2019·Granted Apr 20, 2021·0 cites·19 claims
Showing the top 50 of 79 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →