Inventor · disambiguated record
Yu-Hua Chen
Also filed as: CHEN YU · CHEN YU-HUA
66 granted patents·21 pending applications·380 citations·filing 1987–2024
98Inventor score
Files withUNIMICRON TECHNOLOGY CORP38IND TECH RES INST18DOW GLOBAL TECHNOLOGIES LLC5CHEN JUI-HSIANG4CHEN YU HUA4
Top patents by PatentIndex Score
87 records- 0197US7294920B2Wafer-leveled chip packaging structure and method thereofIND TECH RES INST·Filed 2005·Granted Nov 13, 2007·92 cites·5 claims
- 0294US6989325B2Self-assembled nanometer conductive bumps and method for fabricatingIND TECH RES INST·Filed 2003·Granted Jan 24, 2006·87 cites·6 claims
- 0392US8304666B2Structure of multiple coaxial leads within single via in substrate and manufacturing method thereofKO CHENG-TA·Filed 2009·Granted Nov 6, 2012·41 cites·21 claims
- 0492US7528009B2Wafer-leveled chip packaging structure and method thereofIND TECH RES INST·Filed 2007·Granted May 5, 2009·20 cites·18 claims
- 0590US9854671B1Circuit board and method of manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Dec 26, 2017·4 cites·10 claims
- 0690US8513532B2Flexible circuit structure with stretchability and method of manufacturing the sameCHEN YU-HUA·Filed 2011·Granted Aug 20, 2013·11 cites·4 claims
- 0789US11139234B1Package carrier and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Oct 5, 2021·2 cites·5 claims
- 0884US9860980B1Circuit board elementUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Jan 2, 2018·4 cites·10 claims
- 0983US9485874B2Package substrate having photo-sensitive dielectric layer and method of fabricating the sameIND TECH RES INST·Filed 2013·Granted Nov 1, 2016·7 cites·19 claims
- 1081US11854961B2Package substrate and method of fabricating the same and chip package structureIND TECH RES INST·Filed 2020·Granted Dec 26, 2023·1 cites·27 claims
- 1181US10685922B2Package structure with structure reinforcing element and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Jun 16, 2020·2 cites·8 claims
- 1281US8915634B2Plane light source and flexible plane light sourceHSU CHAO-KAI·Filed 2012·Granted Dec 23, 2014·11 cites·23 claims
- 1380US8314482B2Semiconductor package deviceCHEN SHOU-LUNG·Filed 2007·Granted Nov 20, 2012·8 cites·20 claims
- 1479US9859159B2Interconnection structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Jan 2, 2018·3 cites·3 claims
- 1578US11445617B2Package structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Sep 13, 2022·2 cites·13 claims
- 1678US10068847B2Package substrate and method of fabricating the sameIND TECH RES INST·Filed 2017·Granted Sep 4, 2018·2 cites·4 claims
- 1777US8269112B2Flexible circuit structureLEE YUAN-CHANG·Filed 2008·Granted Sep 18, 2012·11 cites·14 claims
- 1875US10141224B2Manufacturing method of interconnection structureUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Nov 27, 2018·2 cites·6 claims
- 1974US11476592B2Antenna module and antenna housingTAOGLAS GROUP HOLDINGS LTD·Filed 2020·Granted Oct 18, 2022·1 cites·20 claims
- 2074US11251350B2Light-emitting diode package and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Feb 15, 2022·2 cites·7 claims
- 2174USD768945SAnti-mildew and antiseptic stickerCHEN YU-HUA·Filed 2015·Granted Oct 11, 2016·16 cites·1 claims
- 2274US8968765B2Brush polymer and medical use thereofCHEN JUI-HSIANG·Filed 2012·Granted Mar 3, 2015·7 cites·17 claims
- 2371US10658282B2Package substrate structure and bonding method thereofUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted May 19, 2020·1 cites·7 claims
- 2471US9059181B2Wafer leveled chip packaging structure and method thereofINVENSAS CORP·Filed 2013·Granted Jun 16, 2015·2 cites·14 claims
- 2570US11791256B2Package substrate and method of fabricating the sameIND TECH RES INST·Filed 2020·Granted Oct 17, 2023·0 cites·9 claims
- 2670US9737607B2Polymer, and pharmaceutical composition employing the sameIND TECH RES INST·Filed 2015·Granted Aug 22, 2017·1 cites·19 claims
- 2770US2024186724A1Connection system for use with an antenna boxTAOGLAS GROUP HOLDINGS LTD·Filed 2023·Application pending·0 cites
- 2869US11811145B2Antenna box module and antenna boxTAOGLAS GROUP HOLDINGS LTD·Filed 2022·Granted Nov 7, 2023·0 cites·22 claims
- 2969US11410940B2Package structure with structure reinforcing element and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Aug 9, 2022·0 cites·6 claims
- 3069US10083901B2Method for manufacturing circuit redistribution structureUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Sep 25, 2018·1 cites·7 claims
- 3169US7763895B2Flexible light source device and fabrication method thereofIND TECH RES INST·Filed 2009·Granted Jul 27, 2010·4 cites·21 claims
- 3268US9368442B1Method for manufacturing an interposer, interposer and chip package structureUNIMICRON TECHNOLOGY CORP·Filed 2014·Granted Jun 14, 2016·2 cites·13 claims
- 3367US12414243B2Manufacturing method of package structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Sep 9, 2025·0 cites·10 claims
- 3467USD920174SBicycle stemGOGORO INC·Filed 2020·Granted May 25, 2021·4 cites·1 claims
- 3567US10957658B2Package structure with structure reinforcing element and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Mar 23, 2021·0 cites·9 claims
- 3667US9887153B2Circuit redistribution structure unit and method for manufacturing circuit redistribution structureUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Feb 6, 2018·1 cites·3 claims
- 3767US7632707B2Electronic device package and method of manufacturing the sameIND TECH RES INST·Filed 2005·Granted Dec 15, 2009·3 cites·8 claims
- 3866US12414235B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Sep 9, 2025·0 cites·10 claims
- 3964US11532543B2Manufacturing method of package carrierUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Dec 20, 2022·0 cites·5 claims
- 4064US8587091B2Wafer-leveled chip packaging structure and method thereofCHEN SHOU-LUNG·Filed 2012·Granted Nov 19, 2013·1 cites·4 claims
- 4164US7163885B2Method of migrating and fixing particles in a solution to bumps on a chipIND TECH RES INST·Filed 2004·Granted Jan 16, 2007·11 cites·26 claims
- 4263US12396100B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Aug 19, 2025·0 cites·17 claims
- 4361US9302151B2Bowed stringed instrument bowing exercise apparatus and manufacturing method thereofCHEN YU-HUA·Filed 2014·Granted Apr 5, 2016·0 cites·17 claims
- 4460US10950687B2Manufacturing method of substrate structureUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Mar 16, 2021·0 cites·11 claims
- 4560US2014186415A1Polymer composition and polymer materialIND TECH RES INST·Filed 2013·Application pending·0 cites
- 4660US2021193608A1Circuit board element and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 4759US2025365865A1Substrate structureUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 4858US10867907B2Package substrate and method of fabricating the sameIND TECH RES INST·Filed 2018·Granted Dec 15, 2020·0 cites·3 claims
- 4957US11366381B2Mask structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Jun 21, 2022·0 cites·4 claims
- 5057US10854803B2Manufacturing method of light emitting device package structure with circuit redistribution structureUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Dec 1, 2020·0 cites·3 claims
Showing the top 50 of 87 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →