Inventor · disambiguated record
Yu-Tung Chen
Also filed as: CHEN YU · CHEN YU-TUNG
11 granted patents·7 pending applications·24 citations·filing 2006–2024
84Inventor score
Top patents by PatentIndex Score
18 records- 0186US2024385507A1Mask defect preventionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0284US12124163B2Mask defect preventionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 0384US11402743B2Mask defect preventionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 2, 2022·1 cites·20 claims
- 0483US8386304B2Methods for interactive television and mobile deviceCHEN YU·Filed 2008·Granted Feb 26, 2013·18 cites·26 claims
- 0581US11604552B1Metal mesh structureHENGHAO TECH CO LTD·Filed 2022·Granted Mar 14, 2023·1 cites·10 claims
- 0680US11860530B2Mask defect preventionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 2, 2024·0 cites·20 claims
- 0765US12436654B1Touch panelHENGHAO TECH CO LTD·Filed 2024·Granted Oct 7, 2025·0 cites·14 claims
- 0858US8159619B2Multi-standard integrated television receiverCHEN YU-TUNG·Filed 2009·Granted Apr 17, 2012·2 cites·7 claims
- 0956US12128464B2Corrugated-flat rolling composite method for steel/aluminum/aluminum alloy laminated composite platesUNIV TAIYUAN TECHNOLOGY·Filed 2020·Granted Oct 29, 2024·0 cites·10 claims
- 1056US2024178112A1Semiconductor package structure and method of forming the sameMEDIATEK INC·Filed 2023·Application pending·0 cites
- 1153US2016376481A1Adhesive composition for use in steel plates, and thermoplastic resin coated steel plate using samePANASONIC IP MAN CO LTD·Filed 2014·Application pending·0 cites
- 1252US2024112963A1Semiconductor structureMEDIATEK INC·Filed 2023·Application pending·0 cites
- 1351US7379484B2Laser diode control circuit loopTM TECHNOLOGY INC·Filed 2006·Granted May 27, 2008·2 cites·14 claims
- 1450US2023386954A1Wafer level chip scale package with sidewall protectionMEDIATEK INC·Filed 2023·Application pending·0 cites
- 1543US10388541B2Wafer coating system and method of manufacturing chip packageXINTEC INC·Filed 2016·Granted Aug 20, 2019·0 cites·14 claims
- 1641US9613904B2Semiconductor structure and manufacturing method thereofXINTEC INC·Filed 2016·Granted Apr 4, 2017·0 cites·12 claims
- 1741US2018284327A1Anti-glare wear-resistant cover plate and manufacturing method thereofHENGHAO TECH CO LTD·Filed 2018·Application pending·0 cites
- 1832US2016004434A1Information Input Device and MethodHENGHAO TECHNOLOGY CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →