Inventor · disambiguated record
Yung Ching Chen
Also filed as: CHEN YUNG-CHING
19 granted patents·5 pending applications·117 citations·filing 2002–2023
92Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD8TAIWAN SEMICONDUCTOR MFG4YU CHEN-HUA4CHEN YUNG-CHING1LII MIRNG-JI1
Top patents by PatentIndex Score
24 records- 0197US9171790B2Package on package devices and methods of packaging semiconductor diesYU CHEN-HUA·Filed 2012·Granted Oct 27, 2015·40 cites·19 claims
- 0297US8642393B1Package on package devices and methods of forming sameYU CHEN-HUA·Filed 2012·Granted Feb 4, 2014·48 cites·19 claims
- 0388US9768105B2Rigid interconnect structures in package-on-package assembliesLII MIRNG-JI·Filed 2012·Granted Sep 19, 2017·12 cites·20 claims
- 0478US11996368B2Pad structure for enhanced bondabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 28, 2024·0 cites·20 claims
- 0572US11728279B2Pad structure for enhanced bondabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 15, 2023·0 cites·20 claims
- 0667US7337759B1EngineCHEN YUNG-CHING·Filed 2006·Granted Mar 4, 2008·7 cites·9 claims
- 0766US9632516B2Gas-supply system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Apr 25, 2017·2 cites·20 claims
- 0866US9397137B2Interconnect structure for CIS flip-chip bonding and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 19, 2016·1 cites·20 claims
- 0966US8796132B2System and method for forming uniform rigid interconnect structuresSUNG MING-CHUNG·Filed 2012·Granted Aug 5, 2014·2 cites·20 claims
- 1064US8890274B2Interconnect structure for CIS flip-chip bonding and methods for forming the sameYU CHEN-HUA·Filed 2012·Granted Nov 18, 2014·1 cites·20 claims
- 1158US11227836B2Pad structure for enhanced bondabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 18, 2022·0 cites·20 claims
- 1254US10090345B2Interconnect structure for CIS flip-chip bonding and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 2, 2018·0 cites·20 claims
- 1352US11804826B2Semiconductor devices with flexibility in capacitor design for power noise reductionMEDIATEK SINGAPORE PTE LTD·Filed 2022·Granted Oct 31, 2023·0 cites·20 claims
- 1452USRE49045EPackage on package devices and methods of packaging semiconductor diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 19, 2022·0 cites·40 claims
- 1551US9362197B2Molded underfilling for package on package devicesTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jun 7, 2016·0 cites·20 claims
- 1649US11139281B2Molded underfilling for package on package devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 5, 2021·0 cites·20 claims
- 1749US10020286B2Package on package devices and methods of packaging semiconductor diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 10, 2018·0 cites·20 claims
- 1848US6662764B2Two stroke engineFiled 2002·Granted Dec 16, 2003·4 cites·4 claims
- 1944US2008197461A1Apparatus for wire bonding and integrated circuit chip packageTAIWAN SEMICONDUCTOR MFG·Filed 2007·Application pending·0 cites
- 2044US2021041889A1Semantic map orientation device and method, and robotPEGATRON CORP·Filed 2020·Application pending·0 cites
- 2141US2013241058A1Wire Bonding Structures for Integrated CircuitsYU CHEN-HUA·Filed 2012·Application pending·0 cites
- 2240US2016035563A1Apparatus and method for processing semiconductor wafersTAIWAN SEMICONDUCTOR MFG·Filed 2014·Application pending·0 cites
- 2336US8927877B2Looped interconnect structureSHEN HSIN-AN·Filed 2012·Granted Jan 6, 2015·0 cites·20 claims
- 2436US2010081273A1Method for fabricating conductive patternPOWERCHIP SEMICONDUCTOR CORP·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →