Inventor · disambiguated record
Yu-Jen Cheng
Also filed as: CHENG YU · CHENG YU-JEN
24 granted patents·7 pending applications·70 citations·filing 2001–2024
94Inventor score
Top patents by PatentIndex Score
31 records- 0197US12237288B2Semiconductor die package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·6 cites·20 claims
- 0297US9691708B1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 27, 2017·26 cites·20 claims
- 0396US11990443B2Semiconductor die package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 21, 2024·4 cites·20 claims
- 0488US2024386744A1Fingerprint Sensor Device and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0587US9904776B2Fingerprint sensor pixel array and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 27, 2018·3 cites·20 claims
- 0685US10878073B2Fingerprint sensor pixel array and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 29, 2020·1 cites·20 claims
- 0784US12394242B2Fingerprint sensor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 0884US10157274B2Fingerprint sensor pixel array and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 18, 2018·2 cites·20 claims
- 0982US9898645B2Fingerprint sensor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 20, 2018·2 cites·20 claims
- 1082US9132523B2Chemical mechanical polish process control for improvement in within-wafer thickness uniformityLEE SHEN-NAN·Filed 2012·Granted Sep 15, 2015·5 cites·20 claims
- 1177US11727714B2Fingerprint sensor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 1277US10268872B2Fingerprint sensor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·1 cites·20 claims
- 1376US9850126B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 26, 2017·2 cites·20 claims
- 1474US9666530B1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 30, 2017·2 cites·20 claims
- 1572US8079737B2Reflection-type light-emitting module with high heat-dissipating and high light-generating efficiencyWANG BILY·Filed 2009·Granted Dec 20, 2011·8 cites·17 claims
- 1671US10125014B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 13, 2018·1 cites·20 claims
- 1771US8129279B2Chemical mechanical polish process control for improvement in within-wafer thickness uniformityLEE SHEN-NAN·Filed 2008·Granted Mar 6, 2012·4 cites·22 claims
- 1867US8239056B2Advanced process control for new tapeout productHSU CHIH-WEI·Filed 2009·Granted Aug 7, 2012·2 cites·20 claims
- 1965US10658334B2Method for forming a package structure including a package layer surrounding first connectors beside an integrated circuit die and second connectors below the integrated circuit dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 19, 2020·1 cites·20 claims
- 2064US11194990B2Fingerprint sensor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 7, 2021·0 cites·20 claims
- 2164US10698994B2Fingerprint sensor pixel array and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 30, 2020·0 cites·19 claims
- 2254US11121288B2Package structure of light-emitting elementLEXTAR ELECTRONICS CORP·Filed 2019·Granted Sep 14, 2021·0 cites·20 claims
- 2349US2009266601A1Protective cover for prevention of electromagnetism interferenceCHENG YU-JEN·Filed 2008·Application pending·0 cites
- 2449US2009265931A1Method for manufacturing protective cover for prevention of electromagnetism interferenceCHENG YU-JEN·Filed 2008·Application pending·0 cites
- 2545US2013024019A1Apparatus and methods for end point determination in semiconductor processingTAIWAN SEMICONDUCTOR MFG·Filed 2011·Application pending·0 cites
- 2640US11146056B2Interface control circuit and control method thereofRICHTEK TECHNOLOGY CORP·Filed 2020·Granted Oct 12, 2021·0 cites·29 claims
- 2740US8445296B2Apparatus and methods for end point determination in reactive ion etchingWANG CHIEN RHONE·Filed 2011·Granted May 21, 2013·0 cites·15 claims
- 2840US2015328851A1Structure of Vulcanization MachineSUPERIOR STAR ENGINEERING CO LTD·Filed 2014·Application pending·0 cites
- 2938US2012119231A1Led package structure with a deposited-type phosphor layer and method for making the sameWANG BILY·Filed 2011·Application pending·0 cites
- 3038US2012106171A1Led package structureWANG BILY·Filed 2011·Application pending·0 cites
- 3135US6522235B2Switch structure for a heating deviceFiled 2001·Granted Feb 18, 2003·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →