Inventor · disambiguated record
Yung-Cheng Chuang
Also filed as: CHUANG YUNG-CHENG
8 granted patents·2 pending applications·78 citations·filing 2000–2023
85Inventor score
Files withCHENG UEI PREC IND CO LTD3ORIENT SEMICONDUCTOR ELECT LTD3CHUANG YUNG YU1CHUANG YUNG-CHENG1
Top patents by PatentIndex Score
10 records- 0193US8950717B2Supporting deviceCHENG UEI PREC IND CO LTD·Filed 2013·Granted Feb 10, 2015·42 cites·6 claims
- 0288US11932342B2Taillight assembly of a bicycleCHENG UEI PREC IND CO LTD·Filed 2023·Granted Mar 19, 2024·2 cites·9 claims
- 0362USD664529SMobile phone charger holderCHUANG YUNG-CHENG·Filed 2011·Granted Jul 31, 2012·15 cites·1 claims
- 0452US6390356B1Method of forming cylindrical bumps on a substrate for integrated circuitsORIENT SEMICONDUCTOR ELECT LTD·Filed 2000·Granted May 21, 2002·5 cites·1 claims
- 0551US6358834B1Method of forming bumps on wafers or substratesORIENT SEMICONDUCTOR ELECT LTD·Filed 2000·Granted Mar 19, 2002·6 cites·2 claims
- 0649US6274491B1Process of manufacturing thin ball grid array substratesORIENT SEMICONDUCTOR ELECT LTD·Filed 2000·Granted Aug 14, 2001·6 cites·1 claims
- 0739USD806649SWireless chargerCHENG UEI PREC IND CO LTD·Filed 2016·Granted Jan 2, 2018·2 cites·1 claims
- 0835US10914540B1Water cooling system for providing water with constant temperatureCHUANG YUNG YU·Filed 2019·Granted Feb 9, 2021·0 cites·6 claims
- 0932US2002056741A1Application of wire bonding technology on wafer bump, wafer level chip scale package structure and the method of manufacturing the sameFiled 2001·Application pending·0 cites
- 1031US2002072216A1Manufacturing method for multilayer high density substrateFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →