Inventor · disambiguated record
Yu D. Cong
Also filed as: CONG YU · CONG YU D
6 granted patents·1,262 citations·filing 1997–2002
90Inventor score
Files withAPPLIED MATERIALS INC6
Top patents by PatentIndex Score
6 records- 0196US6413383B1Method for igniting a plasma in a sputter reactorAPPLIED MATERIALS INC·Filed 2000·Granted Jul 2, 2002·92 cites·15 claims
- 0296US6402806B1Method for unreacted precursor conversion and effluent removalAPPLIED MATERIALS INC·Filed 2000·Granted Jun 11, 2002·436 cites·34 claims
- 0395US6582569B1Process for sputtering copper in a self ionized plasmaAPPLIED MATERIALS INC·Filed 2000·Granted Jun 24, 2003·75 cites·21 claims
- 0495US6099649AChemical vapor deposition hot-trap for unreacted precursor conversion and effluent removalAPPLIED MATERIALS INC·Filed 1997·Granted Aug 8, 2000·480 cites·18 claims
- 0594US6398929B1Plasma reactor and shields generating self-ionized plasma for sputteringAPPLIED MATERIALS INC·Filed 1999·Granted Jun 4, 2002·128 cites·22 claims
- 0692US6893541B2Multi-step process for depositing copper seed layer in a viaAPPLIED MATERIALS INC·Filed 2002·Granted May 17, 2005·51 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →