Inventor · disambiguated record
Yuuji Hisazato
Also filed as: HISAZATO YUUJI
6 granted patents·8 pending applications·12 citations·filing 2006–2017
74Inventor score
Top patents by PatentIndex Score
14 records- 0175US9123704B2Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2014·Granted Sep 1, 2015·4 cites·8 claims
- 0275US7361272B2Anisotropic porous materialTOSHIBA KK·Filed 2006·Granted Apr 22, 2008·5 cites·12 claims
- 0360US8957522B2Semiconductor device and manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2013·Granted Feb 17, 2015·1 cites·14 claims
- 0450US8641286B2Composite bearing member, manufacturing method of composite bearing member, bearing device and rotary electrical machineLONG THAN TRONG·Filed 2009·Granted Feb 4, 2014·2 cites·6 claims
- 0548US9466558B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2014·Granted Oct 11, 2016·0 cites·15 claims
- 0646US2015078414A1Method of testing semiconductor device and apparatus of testing semiconductor deviceTOSHIBA KK·Filed 2014·Application pending·0 cites
- 0745US2007178007A1Lead-free solder, solder joint product and electronic componentTOSHIBA KK·Filed 2006·Application pending·0 cites
- 0843US2011091351A1Bonding compositionLONG THAN TRONG·Filed 2008·Application pending·0 cites
- 0942US2015262959A1Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2014·Application pending·0 cites
- 1042US2015076516A1Semiconductor device and semiconductor moduleTOSHIBA KK·Filed 2014·Application pending·0 cites
- 1141US2014284797A1Power semiconductor device fabrication method, power semiconductor deviceTOSHIBA KK·Filed 2013·Application pending·0 cites
- 1237US2011026864A1Sliding material, method of manufacturing sliding material, and bearing apparatus using the sameTOSHIBA KK·Filed 2009·Application pending·0 cites
- 1335US2018233464A1Semiconductor moduleTOSHIBA KK·Filed 2017·Application pending·0 cites
- 1432US11088118B2Semiconductor deviceTOSHIBA KK·Filed 2017·Granted Aug 10, 2021·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →