US2011091351A1PendingUtilityA1

Bonding composition

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Assignee: LONG THAN TRONGPriority: Aug 24, 2007Filed: Aug 18, 2008Published: Apr 21, 2011
Est. expiryAug 24, 2027(~1.1 yrs left)· nominal 20-yr term from priority
Inventors:Than Trong LongYuuji Hisazato
B23K 35/262B23K 35/264C22C 13/02B32B 15/01C22C 13/00C22C 12/00
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PatentIndex Score
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Claims

Abstract

A bonding composition ( 12 ) contains 0.01-1 wt % of Ge and 0.01 to 1 wt % of Si, and a balance of a Sn alloy. The bonding composition ( 12 ) has excellent bonding strength.

Claims

exact text as granted — not AI-modified
1 . A bonding composition, comprising,
 0.01 to 1 wt % of Ge, 0.01 to 1 wt % of Si, and a balance of Sn or a Sn alloy.   
     
     
         2 . The bonding composition according to  claim 1 ,
 wherein 0.01 to 1 wt % of Co is further contained.   
     
     
         3 . The bonding composition according to  claim 1 ,
 wherein 0.01 to 1 wt % of Ti is further contained.   
     
     
         4 . The bonding composition according to  claim 2 ,
 wherein 0.01 to 1 wt % of Ti is further contained.

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