Inventor · disambiguated record
Yueh-Feng Ho
Also filed as: HO YUEH-FENG
10 granted patents·9 pending applications·127 citations·filing 1996–2013
89Inventor score
Files withHUANG CHAO-YUAN6IPENVAL CONSULTANT INC3UNITED MICROELECTRONICS CORP3UNITED SEMICONDUCTOR CORP3UNITED MICROELECTRONIC CORP1
Top patents by PatentIndex Score
19 records- 0188US8890607B2Stacked chip systemHUANG CHAO-YUAN·Filed 2013·Granted Nov 18, 2014·12 cites·16 claims
- 0276US6258713B1Method for forming dual damascene structureUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jul 10, 2001·53 cites·16 claims
- 0370US8952500B2Semiconductor deviceIPENVAL CONSULTANT INC·Filed 2013·Granted Feb 10, 2015·3 cites·15 claims
- 0466US9030025B2Integrated circuit layoutHUANG CHAO-YUAN·Filed 2013·Granted May 12, 2015·2 cites·20 claims
- 0557US6133143AMethod of manufacturing interconnectUNITED SEMICONDUCTOR CORP·Filed 1999·Granted Oct 17, 2000·22 cites·11 claims
- 0655US6518164B1Etching process for forming the trench with high aspect ratioUNITED MICROELECTRONICS CORP·Filed 2001·Granted Feb 11, 2003·7 cites·8 claims
- 0744US6136694AMethod for forming via holeUNITED SEMICONDUCTOR CORP·Filed 1998·Granted Oct 24, 2000·12 cites·13 claims
- 0843US8853090B1Method for fabricating a through-silicon viaIPENVAL CONSULTANT INC·Filed 2013·Granted Oct 7, 2014·0 cites·20 claims
- 0942US6083825AMethod of forming unlanded via holeUNITED SEMICONDUCTOR CORP·Filed 1999·Granted Jul 4, 2000·10 cites·13 claims
- 1040US2014264913A1Semiconductor DeviceHUANG CHAO-YUAN·Filed 2013·Application pending·0 cites
- 1140US2014264915A1Stacked Integrated Circuit SystemHUANG CHAO-YUAN·Filed 2013·Application pending·0 cites
- 1240US2014264630A1Integrated StructureHUANG CHAO-YUAN·Filed 2013·Application pending·0 cites
- 1340US2014264869A1Semiconductor DeviceHUANG CHAO-YUAN·Filed 2013·Application pending·0 cites
- 1439US2014264917A1A Semiconductor Device with a Through-Silicon Via and a Method for Making the SameIPENVAL CONSULTANT INC·Filed 2013·Application pending·0 cites
- 1536US5882537AMetallic precipitate monitoring methodUNITED MICROELECTRONIC CORP·Filed 1996·Granted Mar 16, 1999·6 cites·10 claims
- 1635US2001009248A1Metal etching processFiled 2001·Application pending·0 cites
- 1735US2001009249A1Metal etching processFiled 2001·Application pending·0 cites
- 1831US2003045118A1Method for controlling the critical dimension of the polysilicon gate by etching the hard maskUNITED MICROELECTRONICS CORP·Filed 2001·Application pending·0 cites
- 1929US2003022513A1Polymer debris pre-cleaning methodFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →