Inventor · disambiguated record
Yu-Te Hsieh
Also filed as: HSIEH YU-TE
23 granted patents·19 pending applications·215 citations·filing 2000–2025
94Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC31IND TECH RES INST4TONG HSING ELECTRONIC INDUSTRIES LTD4CELSIA TECHNOLOGIES TAIWAN INC1HSIEH YU-TE1
Top patents by PatentIndex Score
42 records- 0196US11869912B2Method for defining a gap height within an image sensor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Jan 9, 2024·4 cites·20 claims
- 0296US7300865B2Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesiveIND TECH RES INST·Filed 2005·Granted Nov 27, 2007·53 cites·10 claims
- 0393US6919642B2Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive and structures formedIND TECH RES INST·Filed 2002·Granted Jul 19, 2005·66 cites·13 claims
- 0487US11444111B2Image sensor package having a light blocking memberSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Sep 13, 2022·4 cites·19 claims
- 0586US10290672B2Image sensor semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted May 14, 2019·5 cites·4 claims
- 0683US12107105B2Method for defining a gap height within an image sensor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Oct 1, 2024·0 cites·20 claims
- 0783US11037970B2Semiconductor package structure and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Jun 15, 2021·1 cites·20 claims
- 0883US10714454B2Stack packaging structure for an image sensorSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Jul 14, 2020·4 cites·20 claims
- 0983US8791536B2Stacked sensor packaging structure and methodKINSMAN LARRY·Filed 2012·Granted Jul 29, 2014·9 cites·19 claims
- 1082US2025022898A1Method for defining a gap height within an image sensor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 1181US6767818B1Method for forming electrically conductive bumps and devices formedIND TECH RES INST·Filed 2000·Granted Jul 27, 2004·34 cites·16 claims
- 1281US2024405043A1Image sensor package having a light blocking memberSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 1380US6605491B1Method for bonding IC chips to substrates with non-conductive adhesiveIND TECH RES INST·Filed 2002·Granted Aug 12, 2003·30 cites·12 claims
- 1478US9515108B2Image sensors with contamination barrier structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Dec 6, 2016·3 cites·15 claims
- 1577US12068345B2Image sensor package having a light blocking memberSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Aug 20, 2024·0 cites·19 claims
- 1677US2025287720A1Cavity packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 1775US2025160014A1Semiconductor package structure and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 1873US12317628B2Image sensor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted May 27, 2025·0 cites·21 claims
- 1973US12237351B2Semiconductor package structure and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Feb 25, 2025·0 cites·19 claims
- 2070US10707257B2Multi-chip packaging structure for an image sensorSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Jul 7, 2020·1 cites·19 claims
- 2167US9859180B2High reliability wafer level semiconductor packagingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Jan 2, 2018·1 cites·12 claims
- 2262US11476292B2Multi-chip packaging structure for an image sensorSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Oct 18, 2022·0 cites·23 claims
- 2360US10790208B2High reliability wafer level semiconductor packagingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Sep 29, 2020·0 cites·17 claims
- 2458US2025309087A1Power chip package structure and manufacturing method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 2558US2025293201A1Power chip package structure and manufacturing method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 2657US2025336878A1Power chip package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 2756US11508776B2Image sensor semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Nov 22, 2022·0 cites·20 claims
- 2856US10290556B2High reliability wafer level semiconductor packagingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted May 14, 2019·0 cites·13 claims
- 2955US10181487B2High reliability housing for a semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Jan 15, 2019·0 cites·18 claims
- 3055US2024234456A1Optical devices including glass cover with patterned antireflective coatingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 3155US2024304639A1Optical sensor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 3254US2019096938A1High reliability housing for a semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Application pending·0 cites
- 3354US2025253197A1Chip package structure and manufacturing method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 3449US2017256576A1High reliability housing for a semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Application pending·0 cites
- 3549US2022223641A1Image sensor package having a cavity structure for a light-transmitting memberSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Application pending·0 cites
- 3647US2008106396A1Signal light for vehicle side-view mirrorHSIEH YU-TE·Filed 2007·Application pending·0 cites
- 3747US2022216255A1Image sensor package having inner and outer joint membersSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Application pending·0 cites
- 3844US10103191B2Semiconductor die and method of packaging multi-die with image sensorSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Oct 16, 2018·0 cites·6 claims
- 3938US2018114804A1High reliability housing for a semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Application pending·0 cites
- 4037US2019172861A1Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Application pending·0 cites
- 4135US2011096219A1Image sensor package and method for manufacturing the sameCELSIA TECHNOLOGIES TAIWAN INC·Filed 2010·Application pending·0 cites
- 4233US2017345862A1Semiconductor package with interposerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →