High reliability housing for a semiconductor package

Abstract

Implementations of semiconductor packages may include: a substrate coupled to one or more die and to one or more connectors, a glass lid coupled over one or more die by an adhesive and a housing comprising one or more sides and a bottom opening and a top opening. The substrate may be coupled to the housing at the bottom opening and the glass lid may be coupled under the housing at the top opening.

1 . A semiconductor package comprising:
 a substrate coupled to one or more die and to one or more connectors;   a glass lid coupled over one or more die by an adhesive; and   a housing comprising one or more sides and a bottom opening and a top opening;   wherein the substrate is coupled to the housing at the bottom opening and the glass lid is coupled under the housing at the top opening.   
     
     
         2 . The semiconductor package of  claim 1 , wherein the substrate is a ball grid array substrate. 
     
     
         3 . The semiconductor package of  claim 1 , wherein the one or more die are stacked on each other. 
     
     
         4 . The semiconductor package of  claim 2 , wherein a mold compound encapsulates at least a portion of one of the one or more die and at least one of the one or more connectors. 
     
     
         5 . The semiconductor package of  claim 1 , wherein the housing is made of an opaque material. 
     
     
         6 . The semiconductor package of  claim 1 , wherein the housing is formed through injection molding, transfer molding and any combination thereof. 
     
     
         7 . The semiconductor package of  claim 1 , wherein a plurality of ball mounts is coupled to a second side of the substrate opposing a side of the substrate coupled to the die. 
     
     
         8 . The semiconductor package of  claim 1 , wherein one or more lenses are coupled to the housing in an optical path of the glass lid. 
     
     
         9 - 20 . (canceled)