Inventor · disambiguated record
Yunwen Huang
Also filed as: HUANG YUNWEN
10 granted patents·11 citations·filing 2007–2019
82Inventor score
Files withACM RESEARCH SHANGHAI INC3ADVANCED MICRO FABRICATION EQUIPMENT INC CHINA3WANG JIAN2MA YUE1NUCH VOHA1
Top patents by PatentIndex Score
10 records- 0182US8518224B2Plating apparatus for metallization on semiconductor workpieceMA YUE·Filed 2007·Granted Aug 27, 2013·4 cites·33 claims
- 0267US9633833B2Methods and apparatus for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2016·Granted Apr 25, 2017·1 cites·14 claims
- 0365US8671961B2Methods and apparatus for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2013·Granted Mar 18, 2014·1 cites·9 claims
- 0464US9595457B2Methods and apparatus for cleaning semiconductor wafersWANG JIAN·Filed 2008·Granted Mar 14, 2017·2 cites·12 claims
- 0561US8580042B2Methods and apparatus for cleaning semiconductor wafersNUCH VOHA·Filed 2007·Granted Nov 12, 2013·2 cites·24 claims
- 0660US9492852B2Methods and apparatus for cleaning semiconductor wafersWANG JIAN·Filed 2009·Granted Nov 15, 2016·1 cites·13 claims
- 0748US10020208B2Methods and apparatus for cleaning semiconductor wafersACM RESEARCH SHANGHAI INC·Filed 2017·Granted Jul 10, 2018·0 cites·17 claims
- 0847US11670515B2Capacitively coupled plasma etching apparatusADVANCED MICRO FABRICATION EQUIPMENT INC CHINA·Filed 2019·Granted Jun 6, 2023·0 cites·9 claims
- 0945US11515168B2Capacitively coupled plasma etching apparatusADVANCED MICRO FABRICATION EQUIPMENT INC CHINA·Filed 2019·Granted Nov 29, 2022·0 cites·9 claims
- 1045US11373843B2Capacitively coupled plasma etching apparatusADVANCED MICRO FABRICATION EQUIPMENT INC CHINA·Filed 2019·Granted Jun 28, 2022·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →