Inventor · disambiguated record
Yu-Hua Huang
Also filed as: HUANG YU · HUANG YU-HUA
37 granted patents·11 pending applications·124 citations·filing 1996–2025
96Inventor score
Files withMEDIATEK INC31MEDIATEK SINGAPORE PTE LTD3CHANG TIEN-CHANG2RAYS OPTICS INC2UNITED MICROELECTRONICS CORP2
Top patents by PatentIndex Score
48 records- 0191US9570399B2Semiconductor package assembly with through silicon via interconnectMEDIATEK INC·Filed 2015·Granted Feb 14, 2017·9 cites·18 claims
- 0290US6919736B1Field programmable gate array having embedded memory with configurable depth and widthLATTICE SEMICONDUCTOR CORP·Filed 2003·Granted Jul 19, 2005·42 cites·13 claims
- 0387US9640489B2Seal ring structure with capacitorMEDIATEK INC·Filed 2014·Granted May 2, 2017·7 cites·24 claims
- 0487US9257392B2Semiconductor package with through silicon via interconnectMEDIATEK INC·Filed 2013·Granted Feb 9, 2016·7 cites·11 claims
- 0587US7544992B2Illuminating efficiency-increasable and light-erasable embedded memory structureUNITED MICROELECTRONICS CORP·Filed 2007·Granted Jun 9, 2009·13 cites·10 claims
- 0686US9543232B2Semiconductor package structure and method for forming the sameMEDIATEK INC·Filed 2015·Granted Jan 10, 2017·4 cites·18 claims
- 0786US8810001B2Seal ring structure with capacitorHUNG CHENG-CHOU·Filed 2012·Granted Aug 19, 2014·9 cites·11 claims
- 0883US9269664B2Semiconductor package with through silicon via interconnect and method for fabricating the sameMEDIATEK INC·Filed 2013·Granted Feb 23, 2016·6 cites·12 claims
- 0983US8242586B2Integrated circuit chip with seal ring structureCHANG TIEN-CHANG·Filed 2009·Granted Aug 14, 2012·12 cites·16 claims
- 1076US2025306782A1Electronic device using external memory device to store hardware setting of semiconductor chip for fast boot and power saving of semiconductor chipMEDIATEK INC·Filed 2025·Application pending·0 cites
- 1175US8278733B2Bonding pad structure and integrated circuit chip using such bonding pad structureYANG MING-TZONG·Filed 2010·Granted Oct 2, 2012·4 cites·20 claims
- 1270US10170435B2Guard ring structure and method for forming the sameMEDIATEK SINGAPORE PTE LTD·Filed 2018·Granted Jan 1, 2019·1 cites·8 claims
- 1369US10727202B2Package structureMEDIATEK INC·Filed 2016·Granted Jul 28, 2020·1 cites·20 claims
- 1469US2023144874A1Apparatuses and methods for coordinating operations associated with multiple subscriber identitiesMEDIATEK INC·Filed 2023·Application pending·0 cites
- 1568US9947627B2Guard ring structure and method for forming the sameMEDIATEK SINGAPORE PTE LTD·Filed 2016·Granted Apr 17, 2018·1 cites·11 claims
- 1667US11736998B2Method for preventing an inter-rat change from being triggered and communications apparatus utilizing the sameMEDIATEK INC·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
- 1767US11348900B2Package structureMEDIATEK INC·Filed 2020·Granted May 31, 2022·0 cites·17 claims
- 1866US9870980B2Semiconductor package with through silicon via interconnectMEDIATEK INC·Filed 2015·Granted Jan 16, 2018·1 cites·6 claims
- 1965US9524948B2Package structureMEDIATEK INC·Filed 2013·Granted Dec 20, 2016·1 cites·12 claims
- 2064US9397032B2Guard ring structure and method for forming the sameMEDIATEK SINGAPORE PTE LTD·Filed 2013·Granted Jul 19, 2016·1 cites·20 claims
- 2164US8987851B2Radio-frequency device package and method for fabricating the sameMEDIATEK INC·Filed 2013·Granted Mar 24, 2015·1 cites·9 claims
- 2264US2023280913A1Electronic device using external memory device to store hardware setting of semiconductor chip for fast boot and power saving of semiconductor chipMEDIATEK INC·Filed 2022·Application pending·0 cites
- 2362US7639536B2Storage unit of single-conductor non-volatile memory cell and method of erasing the sameUNITED MICROELECTRONICS CORP·Filed 2008·Granted Dec 29, 2009·2 cites·18 claims
- 2461US11262524B2Lens structureRAYS OPTICS INC·Filed 2020·Granted Mar 1, 2022·0 cites·20 claims
- 2560US8587090B2Die seal ring structureCHANG TIEN-CHANG·Filed 2012·Granted Nov 19, 2013·1 cites·22 claims
- 2657US11582822B2Apparatuses and methods for coordinating operations associated with multiple subscriber identitiesMEDIATEK INC·Filed 2019·Granted Feb 14, 2023·0 cites·14 claims
- 2757US11424204B2Semiconductor component and manufacturing method thereofMEDIATEK INC·Filed 2020·Granted Aug 23, 2022·0 cites·17 claims
- 2857US11140593B2Method for preventing an inter-RAT change from being triggered and communications apparatus utilizing the sameMEDIATEK INC·Filed 2019·Granted Oct 5, 2021·0 cites·2 claims
- 2956US9899261B2Semiconductor package structure and method for forming the sameMEDIATEK INC·Filed 2016·Granted Feb 20, 2018·0 cites·23 claims
- 3056US2025294473A1Electronic device with dynamic resource control policyMEDIATEK INC·Filed 2024·Application pending·0 cites
- 3155US9786560B2Semiconductor package structure having first and second guard ring regions of different conductivity types and method for forming the sameMEDIATEK INC·Filed 2016·Granted Oct 10, 2017·0 cites·18 claims
- 3253US8232591B2Illuminating efficiency-increasable and light-erasable memorySHIH HUNG-LIN·Filed 2009·Granted Jul 31, 2012·0 cites·10 claims
- 3353US2024273675A1Image calibration method and related image calibration deviceMEDIATEK INC·Filed 2024·Application pending·0 cites
- 3451US9947624B2Semiconductor package assembly with through silicon via interconnectMEDIATEK INC·Filed 2016·Granted Apr 17, 2018·0 cites·21 claims
- 3551US9607894B2Radio-frequency device package and method for fabricating the sameMEDIATEK INC·Filed 2015·Granted Mar 28, 2017·0 cites·9 claims
- 3651US9425098B2Radio-frequency device package and method for fabricating the sameMEDIATEK INC·Filed 2015·Granted Aug 23, 2016·0 cites·12 claims
- 3751US2014021619A1Pad structure and integrated circuit chip with such pad structureMEDIATEK INC·Filed 2013·Application pending·0 cites
- 3851US2019146177A1Lens structureRAYS OPTICS INC·Filed 2017·Application pending·0 cites
- 3950US12218850B2Transmission rate management method and deviceMEDIATEK INC·Filed 2022·Granted Feb 4, 2025·0 cites·18 claims
- 4050US2024412390A1Method and electronic system for image alignmentMEDIATEK INC·Filed 2023·Application pending·0 cites
- 4149US11805054B1Method and electronic device for saving power applied to a routerMEDIATEK INC·Filed 2022·Granted Oct 31, 2023·0 cites·10 claims
- 4246US8779591B2Bump pad structureYANG MING-TZONG·Filed 2011·Granted Jul 15, 2014·0 cites·19 claims
- 4345US2023344876A1Ims call establishing method and electronic device and user equipment thereofMEDIATEK INC·Filed 2022·Application pending·0 cites
- 4445US2011156260A1Pad structure and integrated circuit chip with such pad structureHUANG YU-HUA·Filed 2010·Application pending·0 cites
- 4542US8241014B2Screw compressorsLIU MING HSIN·Filed 2009·Granted Aug 14, 2012·0 cites·8 claims
- 4642US2024338804A1Method and electronic system for high dynamic range (hdr) imagingMEDIATEK INC·Filed 2023·Application pending·0 cites
- 4738US9859192B2Semiconductor structure with through-silicon viaMEDIATEK INC·Filed 2016·Granted Jan 2, 2018·0 cites·22 claims
- 4827US5932115AMethod of manufacturing a crown shape capacitorVANGUARD INT SEMICONDUCT CORP·Filed 1996·Granted Aug 3, 1999·1 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →