Inventor · disambiguated record
Yunhyeok Im
Also filed as: IM YUNHYEOK
19 granted patents·9 pending applications·132 citations·filing 2011–2025
93Inventor score
Top patents by PatentIndex Score
28 records- 0192US9029998B2Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 12, 2015·17 cites·20 claims
- 0291US9978661B2Packaged semiconductor chips having heat dissipation layers and ground contacts thereinIM YUNHYEOK·Filed 2016·Granted May 22, 2018·12 cites·6 claims
- 0391US9324696B2Package-on-package devices, methods of fabricating the same, and semiconductor packagesCHOI MI-NA·Filed 2014·Granted Apr 26, 2016·49 cites·10 claims
- 0488US9583430B2Package-on-package devicePARK KYOL·Filed 2014·Granted Feb 28, 2017·16 cites·16 claims
- 0585US9024434B2Semiconductor packagesIM YUNHYEOK·Filed 2012·Granted May 5, 2015·8 cites·16 claims
- 0683US9391009B2Semiconductor packages including heat exhaust partJANG EON SOO·Filed 2014·Granted Jul 12, 2016·10 cites·19 claims
- 0782US11373933B2Semiconductor package including composite molding structureSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 28, 2022·1 cites·16 claims
- 0881US9356002B2Semiconductor package and method for manufacturing the sameIM YUNHYEOK·Filed 2015·Granted May 31, 2016·4 cites·20 claims
- 0980US12123789B2Method and device for temperature detection and thermal management based on power measurementSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 22, 2024·1 cites·13 claims
- 1080US9013031B2Semiconductor packages including heat diffusion vias and interconnection viasIM YUNHYEOK·Filed 2014·Granted Apr 21, 2015·6 cites·20 claims
- 1179US9190338B2Semiconductor package having a heat slug and a spacerSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 17, 2015·5 cites·15 claims
- 1278US11502061B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 15, 2022·2 cites·20 claims
- 1378US2025357240A1Semiconductor package including a heat dissipation structureSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1472US12394687B2Semiconductor package including a heat dissipation structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 19, 2025·0 cites·20 claims
- 1571US12451400B2Semiconductor package having improved heat dissipation characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
- 1671US11908774B2Semiconductor package including composite molding structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·10 claims
- 1771US11837581B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 5, 2023·0 cites·20 claims
- 1869US10665574B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 26, 2020·1 cites·19 claims
- 1962US11037913B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 15, 2021·0 cites·7 claims
- 2059US11251102B2Semiconductor module including heat dissipation layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
- 2154US2023207417A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2248US2018269126A1Semiconductor packages and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 2344US2020381400A1Semiconductor package and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 2442US2014136827A1Mobile device and data communication method of semiconductor integrated circuit of mobile deviceCHO EUNSEOK·Filed 2013·Application pending·0 cites
- 2540US2015171028A1Semiconductor package and method of fabricating the sameJO CHAJEA·Filed 2014·Application pending·0 cites
- 2639US2012175782A1Semiconductor package and method of manufacturing the sameIM YUNHYEOK·Filed 2012·Application pending·0 cites
- 2738US2012119346A1Semiconductor package and method of forming the sameIM YUNHYEOK·Filed 2011·Application pending·0 cites
- 2833US2012139097A1Semiconductor package and method of manufacturing the sameJIN JEONGGI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →