Inventor · disambiguated record
Yutaka Kadogawa
Also filed as: KADOGAWA YUTAKA
7 granted patents·5 pending applications·26 citations·filing 2003–2025
81Inventor score
Files withSANAN JAPAN TECH CORPORATION3TAIWAN SEMICONDUCTOR MFG CO LTD3LAPIS SEMICONDUCTOR CO LTD2KOIKE OSAMU1OKI SEMICONDUCTOR CO LTD1
Top patents by PatentIndex Score
12 records- 0185US2025266299A1Semiconductor device having a dummy section and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0283US12300543B2Method for manufacturing a semiconductor device having a dummy sectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 0376US8008195B2Method for manufacturing semiconductor deviceOKI SEMICONDUCTOR CO LTD·Filed 2010·Granted Aug 30, 2011·5 cites·6 claims
- 0475US9892968B2Semiconductor device having a dummy portion, method for manufacturing the semiconductor device, method for manufacturing a semiconductor package having the semiconductor deviceKOIKE OSAMU·Filed 2009·Granted Feb 13, 2018·4 cites·6 claims
- 0573US11798847B2Method for manufacturing a semiconductor device having a dummy sectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 24, 2023·0 cites·20 claims
- 0670US8115317B2Semiconductor device including electrode structure with first and second openings and manufacturing method thereofYAMADA SHIGERU·Filed 2009·Granted Feb 14, 2012·5 cites·11 claims
- 0770US7057792B2Optical sensor unit for measuring current and voltage of high frequencyTADAMITSU KANEKO·Filed 2003·Granted Jun 6, 2006·12 cites·11 claims
- 0864US10892189B2Method for manufacturing a semiconductor device having a dummy sectionLAPIS SEMICONDUCTOR CO LTD·Filed 2019·Granted Jan 12, 2021·0 cites·2 claims
- 0959US2018151434A1Method for manufacturing a semiconductor device having a dummy sectionLAPIS SEMICONDUCTOR CO LTD·Filed 2018·Application pending·0 cites
- 1056US2024405744A1Acoustic wave devicesSANAN JAPAN TECH CORPORATION·Filed 2024·Application pending·0 cites
- 1153US2024048119A1Acoustic wave deviceSANAN JAPAN TECH CORPORATION·Filed 2023·Application pending·0 cites
- 1246US2023059423A1Module having elastic wave deviceSANAN JAPAN TECH CORPORATION·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →