Inventor · disambiguated record
Yutaka Kaneda
Also filed as: KANEDA YUTAKA
24 granted patents·7 pending applications·671 citations·filing 1983–2021
96Inventor score
Files withNIPPON TELEGRAPH & TELEPHONE9SONY CHEMICALS CORP9KANEKA CORP5SONY CHEM & INF DEVICE CORP3SONY CORP2
Top patents by PatentIndex Score
31 records- 0196US4536887AMicrophone-array apparatus and method for extracting desired signalNIPPON TELEGRAPH & TELEPHONE·Filed 1983·Granted Aug 20, 1985·148 cites·29 claims
- 0282US4683590AInverse control systemNIPPON TELEGRAPH & TELEPHONE·Filed 1986·Granted Jul 28, 1987·48 cites·25 claims
- 0381US5774562AMethod and apparatus for dereverberationNIPPON TELEGRAPH & TELEPHONE·Filed 1997·Granted Jun 30, 1998·76 cites·17 claims
- 0481US5208864AMethod of detecting acoustic signalNIPPON TELEGRAPH & TELEPHONE·Filed 1990·Granted May 4, 1993·99 cites·5 claims
- 0580US5187692AAcoustic transfer function simulating method and simulator using the sameNIPPON TELEGRAPH & TELEPHONE·Filed 1992·Granted Feb 16, 1993·73 cites·13 claims
- 0679US7407694B2Block copolymerKANEKA CORP·Filed 2005·Granted Aug 5, 2008·10 cites·21 claims
- 0777US6294316B1Processes for manufacturing flexible printed wiring boardsSONY CHEMICALS CORP·Filed 2000·Granted Sep 25, 2001·22 cites·14 claims
- 0876US5539731AEcho cancelling method and apparatus using fast projection schemeNIPPON TELEGRAPH & TELEPHONE·Filed 1995·Granted Jul 23, 1996·76 cites·40 claims
- 0968US6930390B2Flexible printed wiring boardsSONY CHEMICALS CORP·Filed 2001·Granted Aug 16, 2005·13 cites·4 claims
- 1067US7309736B2Acrylic block copolymer and thermoplastic resin compositionKANEKA CORP·Filed 2003·Granted Dec 18, 2007·8 cites·10 claims
- 1165US6312614B1Method for production of interposer for mounting semiconductor elementSONY CHEMICALS CORP·Filed 2000·Granted Nov 6, 2001·19 cites·7 claims
- 1264US12049545B2Uncured laminate, reinforcing fiber composite material, method for producing uncured laminate, and method for producing reinforcing fiber composite materialKANEKA CORP·Filed 2021·Granted Jul 30, 2024·0 cites·13 claims
- 1364US8580903B2Flame retardant, production method therefor, and flame retardant thermoplastic resin composition comprising the sameTAKETANI SHUJI·Filed 2010·Granted Nov 12, 2013·1 cites·10 claims
- 1464US6562250B1Method for manufacturing wiring circuit boards with bumps and method for forming bumpsSONY CHEMICALS CORP·Filed 2000·Granted May 13, 2003·10 cites·3 claims
- 1563US7520053B2Method for manufacturing a bump-attached wiring circuit boardSONY CORP·Filed 2005·Granted Apr 21, 2009·2 cites·8 claims
- 1657US6800816B2Wiring circuit board having bumps and method of producing sameSONY CHEMICALS CORP·Filed 2001·Granted Oct 5, 2004·6 cites·3 claims
- 1753US7211735B2Processes for manufacturing multilayer flexible wiring boardsSONY CHEM & INF DEVICE CORP·Filed 2001·Granted May 1, 2007·3 cites·3 claims
- 1853US6553122B1Method and apparatus for multi-channel acoustic echo cancellation and recording medium with the method recorded thereonNIPPON TELEGRAPH & TELEPHONE·Filed 1999·Granted Apr 22, 2003·22 cites·48 claims
- 1953US2007163111A1Method for manufacturing a multilayer flexible wiring boardSONY CHEM & INF DEVICE CORP·Filed 2007·Application pending·0 cites
- 2051US2018305535A1Injection molded body of polypropylene resin compositionKANEKA CORP·Filed 2018·Application pending·0 cites
- 2149US6518510B2Bump-attached wiring circuit board and method for manufacturing sameSONY CHEMICALS CORP·Filed 2001·Granted Feb 11, 2003·3 cites·8 claims
- 2248US7076868B2Wiring circuit board having bumps and method of producing sameSONY CHEMICALS CORP·Filed 2004·Granted Jul 18, 2006·2 cites·7 claims
- 2348US5408530AEcho cancelling method and echo canceller using the sameNIPPON TELEGRAPH & TELEPHONE·Filed 1993·Granted Apr 18, 1995·17 cites·8 claims
- 2448US2013183536A1Resin composition and molded product thereofKANEKA CORP·Filed 2012·Application pending·0 cites
- 2545US2013184375A1Rubber modified acrylic resin composition excellent in jet-blackness and molded product thereofAOYAMA TAIZO·Filed 2012·Application pending·0 cites
- 2644US7020961B2Method for manufacturing a bump-attached wiring circuit boardSONY CORP·Filed 2002·Granted Apr 4, 2006·1 cites·8 claims
- 2744US5602765AAdaptive transfer function estimating method and estimating device using the sameNIPPON TELEGRAPH & TELEPHONE·Filed 1994·Granted Feb 11, 1997·12 cites·13 claims
- 2843US2015375750A1Automatic transmission control deviceNISSAN MOTOR·Filed 2013·Application pending·0 cites
- 2941US6977349B2Method for manufacturing wiring circuit boards with bumps and method for forming bumpsSONY CHEMICALS CORP·Filed 2003·Granted Dec 20, 2005·0 cites·3 claims
- 3038US2003116350A1Flexible wiring boards and manufacturing processes thereofSONY CHEMICALS CORP·Filed 2001·Application pending·0 cites
- 3137US2007169958A1Mask for exposureSONY CHEM & INF DEVICE CORP·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →