Method for manufacturing a multilayer flexible wiring board

Abstract

In one embodiment, the present invention provides a process for manufacturing a multilayer flexible wiring board, which allows individual layers of wiring boards to be precisely positioned and to be readily stacked. A mask for exposure is prepared in which a plurality of pattern holes corresponding to individual layers of wiring boards of a multilayer flexible wiring board are arranged in the direction perpendicular to the transporting direction P of substrate. This mask for exposure is used to form a plurality of wiring patterns corresponding to individual layers of wiring boards of a multilayer flexible wiring board on the same sheet-like substrate.

1 .- 10 . (canceled)  
     
     
         11 . A method for manufacturing a multilayer flexible wiring board, comprising: 
 preparing a sheet-like flexible substrate comprising a metal foil and a resin layer formed on the metal foil and configured to be transported in a predetermined direction, and a mask for exposure comprising a sheet-like mask body and a plurality of pattern holes formed in the mask body and a group of the pattern holes corresponding to wiring patterns of individual layers of a multilayer flexible wiring board are directly arranged in width direction of the mask body and a plurality of the groups of the pattern holes corresponding to wiring patterns of the individual layers of multilayer flexible wiring boards are directly arranged corresponding to the mask in a transporting direction of a flexible board on which a predetermined wiring patterns are to be formed,    placing the mask for exposure and the flexible substrate to be opposed each other with the metal foil of the flexible substrate facing toward the mask, and    forming a stock sheet part for a multilayer flexible wiring board by arranging a plurality of wiring patterns in predetermined region of the flexible substrate on a same surface of the flexible substrate through a photolithography process including performing an exposure using the mask.    
     
     
         12 . The method of  claim 11 , further comprising: 
 transporting the flexible substrate to the predetermined direction after forming the stock sheet part for a multilayer flexible wiring board in the predetermined region of the flexible substrate; and    forming another stock sheet part for a multilayer flexible wiring board in a region different from the predetermined region on the same surface of the flexible substrate through the photolithography process.