Inventor · disambiguated record
Yu-Chuan Kang
Also filed as: KANG JR YU-CHUAN · KANG YU-CHUAN · KANG YU-CHUAN (TONY)
4 granted patents·12 pending applications·3 citations·filing 2013–2018
61Inventor score
Top patents by PatentIndex Score
16 records- 0182US9983622B2Method of applying a transfer film to metal surfacesHEWLETT PACKARD DEVELOPMENT CO·Filed 2013·Granted May 29, 2018·2 cites·4 claims
- 0266US10104792B2Anti-slip substratesHEWLETT PACKARD DEVELOPMENT CO·Filed 2013·Granted Oct 16, 2018·0 cites·7 claims
- 0366US2019045643A1Anti-Slip SubstratesHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Application pending·0 cites
- 0463US10244647B2Substrate with insulating layerHEWLETT PACKARD DEVELOPMENT CO·Filed 2014·Granted Mar 26, 2019·1 cites·14 claims
- 0563US2018267572A1Method of applying a transfer film to metal surfacesHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Application pending·0 cites
- 0659US10533113B2Sol-gel hybrid coating composition, coating process and composite coating layersHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Jan 14, 2020·0 cites·19 claims
- 0758US2016324026A1Device Casing Including Layered MetalsHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2014·Application pending·0 cites
- 0854US2016326624A1Surface Treatments of Metal SubstratesHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2014·Application pending·0 cites
- 0954US2017183781A1Elastomeric coating on a surfaceHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2014·Application pending·0 cites
- 1052US2016236445A1Composite Layer, Metal Layer and Anodized LayerHEWLETT PACKARD DEVELOPMENT CO·Filed 2013·Application pending·0 cites
- 1151US2017096732A1Multilayer coatings on substratesHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2014·Application pending·0 cites
- 1250US2016251749A1Oxidized Layer and Light Metal Layer on SubstrateHEWLETT PACKARD DEVELOPMENT CO·Filed 2013·Application pending·0 cites
- 1349US2016326664A1Treating a SubstrateHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2014·Application pending·0 cites
- 1447US2016230302A1Method of treating metal surfacesHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2013·Application pending·0 cites
- 1545US2016339537A1Forming a Casing of an Electronics DeviceHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2014·Application pending·0 cites
- 1640US2018297173A1Methods of PolishingHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →