US2019045643A1PendingUtilityA1

Anti-Slip Substrates

Assignee: HEWLETT PACKARD DEVELOPMENT COPriority: Oct 31, 2013Filed: Oct 10, 2018Published: Feb 7, 2019
Est. expiryOct 31, 2033(~7.3 yrs left)· nominal 20-yr term from priority
C25D 13/12A45C 2011/002A45C 2011/003C25D 13/06H05K 5/02A45F 5/00H05K 5/0243A45C 11/00C25D 13/20A45C 11/003A45C 11/002
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Claims

Abstract

A method is provided for modifying a layer of a plastics material containing conductive fibers. The method includes electrophoretically depositing a bead of a polymer material at locations of a surface of the layer where the conductive fibers are exposed.

Claims

exact text as granted — not AI-modified
1 . A method of modifying a layer of a plastics material containing conductive fibers, the method comprising:
 electrophoretically depositing a bead of a polymer material at locations of a surface of the layer where the conductive fibers are exposed.   
     
     
         2 . The method of  claim 1  which includes forming the plastics material as a shell of a housing for a device. 
     
     
         3 . The method of  claim 1 , wherein the conductive fibers are exposed via openings at spaced apart locations of the surface of the layer. 
     
     
         4 . The method of  claim 3 , wherein the bead of the polymer material is electrophoretically deposited at the openings of the spaced apart locations of the layer where the conductive fibers are exposed. 
     
     
         5 . The method of  claim 3 , wherein the conductive fibers are arranged in a weave configuration and points where the conductive fibers cross in the weave configuration define locations where the conductive fibers are exposed. 
     
     
         6 . A method of manufacturing a shell of a housing for a device, the method comprising:
 providing a shell of a plastics material containing conductive fibers which are exposed at spaced apart locations of a surface of the shell; and   electrophoretically depositing beads of polymer material on the surface of the shell at the locations of the surface of the shell.   
     
     
         7 . The method of  claim 6 , further comprising:
 degreasing the surface of the carbon fiber reinforced plastics material with a degreasing agent before the electrophoretic deposition is performed; and   rinsing the surface of the carbon fiber reinforced plastics material to remove the degreasing agent.   
     
     
         8 . The method of  claim 6 , further comprising:
 passivating the surface of the carbon fiber reinforced plastics material before the electrophoretic deposition is performed.   
     
     
         9 . The method of  claim 6 , further comprising:
 applying an insulating film to the surface of the shell in a pattern to form a mask before the electrophoretic deposition.   
     
     
         10 . The method of  claim 9 , further comprising:
 applying the insulating film by at least one of screen printing and ink-jet printing.   
     
     
         11 . The method of  claim 6 , further comprising:
 working the surface of the shell at the locations to expose the conductive fibers before performing the electrophoretic deposition.   
     
     
         12 . The method of  claim 6 , wherein the conductive fibers are exposed via openings at spaced apart locations of the surface of the shell. 
     
     
         13 . The method of  claim 12 , wherein the beads of the polymer material is electrophoretically deposited at the openings of the spaced apart locations of the shell where the conductive fibers are exposed. 
     
     
         14 . The method of  claim 12 , wherein the conductive fibers are arranged in a weave configuration and points where the conductive fibers cross in the weave configuration define locations where the conductive fibers are exposed. 
     
     
         15 . The method of  claim 6 , further comprising:
 curing the beads of polymer material that are electrophoretically deposited on the surface of the shell.

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