Inventor · disambiguated record
Yuji Kawamata
Also filed as: KAWAMATA YUJI
21 granted patents·9 pending applications·91 citations·filing 1996–2025
92Inventor score
Top patents by PatentIndex Score
30 records- 0189US10675719B2Joining member, solder material, solder paste, formed solder, flux coated material, and solder jointSENJU METAL INDUSTRY CO·Filed 2015·Granted Jun 9, 2020·3 cites·9 claims
- 0288US6402013B2Thermosetting soldering flux and soldering processSENJU METAL INDUSTRY CO·Filed 2000·Granted Jun 11, 2002·46 cites·20 claims
- 0386US11377715B2Solder alloy, solder paste, solder ball, solder preform, solder joint, and circuitSENJU METAL INDUSTRY CO·Filed 2020·Granted Jul 5, 2022·2 cites·16 claims
- 0482US8845826B2Lead-free solder for vehicles and a vehicle-mounted electronic circuit using the solderKAWAMATA YUJI·Filed 2008·Granted Sep 30, 2014·11 cites·11 claims
- 0580US2024309913A1Sliding member, bearing, sliding member manufacturing method, and bearing manufacturing methodSENJU METAL INDUSTRY CO·Filed 2024·Application pending·0 cites
- 0677US11819955B2Solder alloy, solder paste, solder ball, solder preform, solder joint, on-board electronic circuit, ECU electronic circuit, on-board electronic circuit device, and ECU electronic circuit deviceSENJU METAL INDUSTRY CO·Filed 2020·Granted Nov 21, 2023·1 cites·13 claims
- 0774US12031579B2Sliding member, bearing, sliding member manufacturing method, and bearing manufacturing methodSENJU METAL INDUSTRY CO·Filed 2021·Granted Jul 9, 2024·0 cites·3 claims
- 0873US2025321511A1Monochrome optical scanning device and monochrome image forming apparatusKAWAMATA YUJI·Filed 2025·Application pending·0 cites
- 0966US5932030AFlux for soldering using solder preformsSONY CORP·Filed 1996·Granted Aug 3, 1999·23 cites·7 claims
- 1064US10173287B2Solder material, solder joint, and method of manufacturing the solder materialSENJU METAL INDUSTRY CO·Filed 2014·Granted Jan 8, 2019·0 cites·6 claims
- 1164US2025003828A1Resin molded article and method for determining deterioration of resin molded articleKAWAMATA YUJI·Filed 2024·Application pending·0 cites
- 1263US10888957B2Soldering materialSENJU METAL INDUSTRY CO·Filed 2016·Granted Jan 12, 2021·1 cites·7 claims
- 1362US8888932B2Indium-containing lead-free solder for vehicle-mounted electronic circuitsKAWAMATA YUJI·Filed 2008·Granted Nov 18, 2014·2 cites·10 claims
- 1460US10147695B2Cu core ballSENJU METAL INDUSTRY CO·Filed 2013·Granted Dec 4, 2018·1 cites·8 claims
- 1558US11826860B2Flux and solder pasteSENJU METAL INDUSTRY CO·Filed 2021·Granted Nov 28, 2023·0 cites·5 claims
- 1657US11571770B2Solder alloy, solder paste, solder ball, solder preform, and solder jointSENJU METAL INDUSTRY CO·Filed 2020·Granted Feb 7, 2023·0 cites·8 claims
- 1754US12194573B2Solder pasteSENJU METAL INDUSTRY CO·Filed 2020·Granted Jan 14, 2025·0 cites·8 claims
- 1854US2024293694A1Foam extinguishing agent raw liquidSENJU METAL INDUSTRY CO·Filed 2024·Application pending·0 cites
- 1953US10610979B2Flux composition for solder applicationsSENJU METAL INDUSTRY CO·Filed 2018·Granted Apr 7, 2020·0 cites·2 claims
- 2053US9073154B2Flux for lead-free solder and soldering methodKAWAMATA YUJI·Filed 2007·Granted Jul 7, 2015·0 cites·17 claims
- 2153US2024337291A1Sliding member and bearingSENJU METAL INDUSTRY CO·Filed 2022·Application pending·0 cites
- 2252US11889042B2Information processing apparatus, information processing system, fee management method, and recording medium that transmits usage fee in response to detecting that first and second users belong to a same groupKAWAMATA YUJI·Filed 2023·Granted Jan 30, 2024·0 cites·7 claims
- 2350US9227258B2Lead-free solder alloy having reduced shrinkage cavitiesKAWAMATA YUJI·Filed 2009·Granted Jan 5, 2016·1 cites·14 claims
- 2449US10811376B2Cu column, Cu core column, solder joint, and through-silicon viaSENJU METAL INDUSTRY CO·Filed 2014·Granted Oct 20, 2020·0 cites·19 claims
- 2546US11813686B2Solder alloy, solder paste, solder ball, solder preform, solder joint, and substrateSENJU METAL INDUSTRY CO·Filed 2020·Granted Nov 14, 2023·0 cites·4 claims
- 2643US2017182601A1Flux-Coated Ball and Method of Manufacturing the SameSENJU METAL INDUSTRY CO·Filed 2016·Application pending·0 cites
- 2742US2010025837A1Composite semiconductor device, semiconductor package and spacer sheet used in the same, and method for manufacturing composite semiconductor deviceLINTEC CORP·Filed 2007·Application pending·0 cites
- 2842US2010090323A1Composite type semiconductor device spacer sheet, semiconductor package using the same, composite type semiconductor device manufacturing method, and composite type semiconductor deviceLINTEC CORP·Filed 2007·Application pending·0 cites
- 2939US11492223B2Sheet conveying device and image forming apparatus incorporating the sheet conveying deviceKAWAMATA YUJI·Filed 2020·Granted Nov 8, 2022·0 cites·7 claims
- 3036US2001019075A1Thermosetting soldering flux and soldering processFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →