Inventor · disambiguated record
Yuta Kimura
Also filed as: KIMURA YUTA
21 granted patents·11 pending applications·75 citations·filing 2008–2025
92Inventor score
Top patents by PatentIndex Score
32 records- 0196US11862787B2Negative electrode active material for lithium-ion battery, negative electrode for lithium-ion battery and lithium-ion batteryDAIDO STEEL CO LTD·Filed 2020·Granted Jan 2, 2024·4 cites·12 claims
- 0288US8638001B2Adhesive sheet for producing semiconductor deviceKIMURA YUTA·Filed 2012·Granted Jan 28, 2014·11 cites·11 claims
- 0387US9123794B2Dicing die bond filmNITTO DENKO CORP·Filed 2013·Granted Sep 1, 2015·10 cites·7 claims
- 0486US10899266B2Snow removal machineHONDA MOTOR CO LTD·Filed 2018·Granted Jan 26, 2021·6 cites·10 claims
- 0584US8380348B2RobotHONDA MOTOR CO LTD·Filed 2009·Granted Feb 19, 2013·27 cites·5 claims
- 0681US12444735B2Si alloy powder for negative electrodeDAIDO STEEL CO LTD·Filed 2023·Granted Oct 14, 2025·1 cites·7 claims
- 0779US2024286290A1Remote operation control system, remote operation control method, and storage mediumHONDA MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 0875US11178738B2Working machineHONDA MOTOR CO LTD·Filed 2018·Granted Nov 16, 2021·2 cites·8 claims
- 0974US12468384B2Sensor device, nontransitory recording medium, and presuming methodKIMURA YUTA·Filed 2024·Granted Nov 11, 2025·0 cites·18 claims
- 1072US10651501B1Solid electrolyte and fluoride ion batteryAMEZAWA KOJI·Filed 2019·Granted May 12, 2020·1 cites·7 claims
- 1169US10780912B2Steering deviceJTEKT CORP·Filed 2018·Granted Sep 22, 2020·2 cites·8 claims
- 1267US9484240B2Film adhesive, dicing tape with film adhesive, method of manufacturing semiconductor device, and semiconductor deviceNITTO DENKO CORP·Filed 2014·Granted Nov 1, 2016·2 cites·15 claims
- 1366US12136854B2Rotating electrical machineNIDEC CORP·Filed 2022·Granted Nov 5, 2024·0 cites·7 claims
- 1465US8150551B2Charging apparatus for mobile robotKANEKO SATOSHI·Filed 2008·Granted Apr 3, 2012·6 cites·8 claims
- 1564US10844561B2VehicleHONDA MOTOR CO LTD·Filed 2018·Granted Nov 24, 2020·1 cites·8 claims
- 1663US10427601B2Working machineHONDA MOTOR CO LTD·Filed 2018·Granted Oct 1, 2019·1 cites·5 claims
- 1761US8659157B2Adhesive composition for producing semiconductor device and adhesive sheet for producing semiconductor deviceKIMURA YUTA·Filed 2012·Granted Feb 25, 2014·1 cites·14 claims
- 1860US2025327162A1Manufacturing method for an aluminum alloy member, and shot peening apparatusSINTOKOGIO LTD·Filed 2025·Application pending·0 cites
- 1958US2024169319A1Information processing system, activity sensor, and non-transitory recording mediumKIMURA YUTA·Filed 2023·Application pending·0 cites
- 2057US12438146B2Electrode material for lithium-ion battery and Si alloy composite powderDAIDO STEEL CO LTD·Filed 2022·Granted Oct 7, 2025·0 cites·9 claims
- 2156US12291828B2Work machineHONDA MOTOR CO LTD·Filed 2022·Granted May 6, 2025·0 cites·6 claims
- 2256US2025050821A1Vehicle exterior componentTOYODA GOSEI KK·Filed 2024·Application pending·0 cites
- 2356US2024372084A1Negative electrode material powder for lithium ion batteryDAIDO STEEL CO LTD·Filed 2022·Application pending·0 cites
- 2455US2025079456A1Lithium ion battery negative electrode active materialDAIDO STEEL CO LTD·Filed 2022·Application pending·0 cites
- 2549US10306734B2Working machine having lights being controlled based upon detected external environmentHONDA MOTOR CO LTD·Filed 2018·Granted May 28, 2019·0 cites·7 claims
- 2648US8748040B2Negative electrode active material for lithium secondary battery and negative electrode for lithium secondary batteryKIMURA YUTA·Filed 2011·Granted Jun 10, 2014·0 cites·16 claims
- 2748US8715857B2Negative electrode active material for lithium ion battery, and negative electrode for lithium ion battery using the sameKIMURA YUTA·Filed 2012·Granted May 6, 2014·0 cites·8 claims
- 2846US2009149993A1RobotHONDA MOTOR CO LTD·Filed 2008·Application pending·0 cites
- 2943US2012061805A1Dicing die bond filmAMANO YASUHIRO·Filed 2011·Application pending·0 cites
- 3041US2020020617A1Resin encapsulating mold and manufacturing method for semiconductor deviceABLIC INC·Filed 2019·Application pending·0 cites
- 3138US2011316474A1Charging apparatus for mobile bodyKIMURA YUTA·Filed 2011·Application pending·0 cites
- 3235US2011190421A1Adhesive composition for producing semiconductor device, and adhesive sheet for producing semiconductor deviceKIMURA YUTA·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →