Inventor · disambiguated record
Yueh-Ling Lee
Also filed as: LEE YUEH-LING
11 granted patents·6 pending applications·458 citations·filing 1992–2011
93Inventor score
Top patents by PatentIndex Score
17 records- 0192US7547849B2Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating theretoDU PONT·Filed 2005·Granted Jun 16, 2009·29 cites·32 claims
- 0292US7504150B2Polymer-based capacitor composites capable of being light-activated and receiving direct metalization, and methods and compositions related theretoDU PONT·Filed 2005·Granted Mar 17, 2009·30 cites·11 claims
- 0392US6150456AHigh dielectric constant flexible polyimide film and process of preparationDU PONT·Filed 1999·Granted Nov 21, 2000·75 cites·4 claims
- 0491US8475924B2Compositions and methods for creating electronic circuitryLEE YUEH-LING·Filed 2008·Granted Jul 2, 2013·24 cites·13 claims
- 0591US7531204B2Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating theretoDU PONT·Filed 2007·Granted May 12, 2009·23 cites·3 claims
- 0691US7026032B2Polyimide based compositions useful as electronic substrates, derived in part from (micro-powder) fluoropolymer, and methods and compositions relating theretoDU PONT·Filed 2003·Granted Apr 11, 2006·50 cites·23 claims
- 0791US6159611AHigh dielectric constant flexible polyimide film and process of preparationDU PONT·Filed 1998·Granted Dec 12, 2000·73 cites·10 claims
- 0887US6218074B1Flexible, flame-retardant, aqueous-processable photoimageable composition for coating flexible printed circuitsDU PONT·Filed 1999·Granted Apr 17, 2001·102 cites·48 claims
- 0983US5331040AAdhesive composition with functional fillerDU PONT·Filed 1992·Granted Jul 19, 1994·48 cites·13 claims
- 1074US8449949B2Compositions and methods for creating electronic circuitryLEE YUEH-LING·Filed 2011·Granted May 28, 2013·3 cites·1 claims
- 1154US8323802B2Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related theretoDUNBAR MEREDITH L·Filed 2009·Granted Dec 4, 2012·1 cites·15 claims
- 1250US2010263919A1Substrates for Electronic Circuitry Type ApplicationsLEE YUEH-LING·Filed 2006·Application pending·0 cites
- 1348US2009017309A1Compositions and methods for creating electronic circuitryDU PONT·Filed 2008·Application pending·0 cites
- 1448US2010181284A1Method of obtaining electronic circuitry featuresDU PONT·Filed 2009·Application pending·0 cites
- 1546US2010193950A1Wafer level, chip scale semiconductor device packaging compositions, and methods relating theretoDU PONT·Filed 2009·Application pending·0 cites
- 1637US2004113127A1Resistor compositions having a substantially neutral temperature coefficient of resistance and methods and compositions relating theretoFiled 2002·Application pending·0 cites
- 1735US2006083939A1Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related theretoDUNBAR MEREDITH L·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →