Inventor · disambiguated record
Yuan Li
Also filed as: LI YUAN · LI YUAN-HSIN
6 granted patents·7 pending applications·14 citations·filing 2001–2025
74Inventor score
Files withYANGTZE MEMORY TECH CO LTD4ADVANCED MICRO FABRICATION EQUIPMENT INC CHINA2HUAWEI TECH CO LTD2ASIA IC MIC PROCESS INC1EVERLIGHT USA INC1
Top patents by PatentIndex Score
13 records- 0184US11177231B2Bonding contacts having capping layer and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Nov 16, 2021·4 cites·17 claims
- 0270US2023317665A1Bonding contacts having capping layer and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 0366US11715718B2Bonding contacts having capping layer and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Aug 1, 2023·0 cites·20 claims
- 0460US2024392437A1Vapor deposition apparatus and substrate treatment methodADVANCED MICRO FABRICATION EQUIPMENT INC CHINA·Filed 2024·Application pending·0 cites
- 0556US2025234186A1Communication method and apparatusHUAWEI TECH CO LTD·Filed 2025·Application pending·0 cites
- 0656US2025348637A1Method for optimizing meshing and establishing hydrodynamic model of shallow lake modelHEBEI INST OF WATER SCIENCE·Filed 2024·Application pending·0 cites
- 0755US6440857B1Two-step CMP method and employed polishing compositionsEVERLIGHT USA INC·Filed 2001·Granted Aug 27, 2002·9 cites·2 claims
- 0850US12062573B2Method for forming barrier layer in semiconductor structureYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Aug 13, 2024·0 cites·20 claims
- 0950US8012307B2Separating device and method thereofASIA IC MIC PROCESS INC·Filed 2009·Granted Sep 6, 2011·1 cites·8 claims
- 1050US2025357207A1Method for depositing tungsten in high-aspect-ratio structure, and semiconductor substrate thereofADVANCED MICRO FABRICATION EQUIPMENT INC CHINA·Filed 2023·Application pending·0 cites
- 1149US2025150940A1Method and apparatus for determining artificial intelligence ai modelHUAWEI TECH CO LTD·Filed 2025·Application pending·0 cites
- 1238US2006016786A1Method and apparatus for removing SiC or low k material filmTSUI BING-YUE·Filed 2004·Application pending·0 cites
- 1336US11097491B1Mask-based partition preheating device and partition preheating method thereofKONTOUR XIAN MEDICAL TECH CO LTD·Filed 2018·Granted Aug 24, 2021·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →