Inventor · disambiguated record
Yu-Ting Li
Also filed as: LI YU · LI YU-TING · Li yu-dong
30 granted patents·15 pending applications·59 citations·filing 2001–2024
94Inventor score
Files withUNITED MICROELECTRONICS CORP30INTEL CORP2WHETRON ELECTRONICS CO LTD2WISTRON CORP2BEIJING BAIDU NETCOM SCI & TECH CO LTD1
Top patents by PatentIndex Score
45 records- 0194US8779526B2Semiconductor deviceHSU CHUN-WEI·Filed 2011·Granted Jul 15, 2014·20 cites·11 claims
- 0289US9773682B1Method of planarizing substrate surfaceUNITED MICROELECTRONICS CORP·Filed 2016·Granted Sep 26, 2017·5 cites·7 claims
- 0386US9147612B2Method for forming a semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Sep 29, 2015·7 cites·9 claims
- 0484US10341658B2Motion, coding, and application aware temporal and spatial filtering for video pre-processingINTEL CORP·Filed 2017·Granted Jul 2, 2019·4 cites·24 claims
- 0584US9905430B1Method for forming semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 27, 2018·4 cites·16 claims
- 0681US9875909B1Method for planarizing material layerUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jan 23, 2018·3 cites·18 claims
- 0779US9384996B2Method for manufacturing semiconductor device and device manufactured by the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jul 5, 2016·4 cites·21 claims
- 0874US9502303B2Method for manufacturing semiconductor device with a barrier layer having overhung portionsUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 22, 2016·2 cites·19 claims
- 0973US11197008B2Method and system of content-adaptive denoising for video codingINTEL CORP·Filed 2019·Granted Dec 7, 2021·1 cites·25 claims
- 1068US10543367B2Transcranial burst electrostimulation apparatus and its applicationsUNIV TAIPEI MEDICAL·Filed 2015·Granted Jan 28, 2020·3 cites·13 claims
- 1167US10868201B1Front-side conductive paste for crystalline silicon solar cell, preparation method therefor, and solar cellSOLTRIUM ADVANCED MATERIALS TECH LTD SUZHOU·Filed 2020·Granted Dec 15, 2020·0 cites·15 claims
- 1266US9673053B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jun 6, 2017·1 cites·3 claims
- 1366US9443726B1Semiconductor processUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 13, 2016·1 cites·20 claims
- 1466US9012300B2Manufacturing method for a shallow trench isolationUNITED MICROELECTRONICS CORP·Filed 2012·Granted Apr 21, 2015·2 cites·8 claims
- 1565US12320849B2Clock control circuit and methodREALTEK SEMICONDUCTOR CORP·Filed 2024·Granted Jun 3, 2025·0 cites·20 claims
- 1664US10797185B2Front-side conductive paste for crystalline silicon solar cell, preparation method therefor, and solar cellSOLTRIUM ADVANCED MATERIALS TECH LTD SHENZHEN·Filed 2019·Granted Oct 6, 2020·0 cites·13 claims
- 1764US9093465B2Method of fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2013·Granted Jul 28, 2015·1 cites·11 claims
- 1862US9466484B1Manufacturing method of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Oct 11, 2016·1 cites·20 claims
- 1960US10923481B2Semiconductor integrated circuit structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Feb 16, 2021·0 cites·7 claims
- 2059US10943910B2Method for forming semiconductor integrated circuit structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Mar 9, 2021·0 cites·10 claims
- 2158US10103034B2Method of planarizing substrate surfaceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Oct 16, 2018·0 cites·6 claims
- 2258US10049887B2Method of planarizing substrate surfaceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 14, 2018·0 cites·7 claims
- 2354US10128251B2Semiconductor integrated circuit structure and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Nov 13, 2018·0 cites·6 claims
- 2454US8940600B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jan 27, 2015·0 cites·8 claims
- 2548US10276367B1Method for improving wafer surface uniformityUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 30, 2019·0 cites·8 claims
- 2648US9299600B2Method for repairing an oxide layer and method for manufacturing a semiconductor structure applying the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Mar 29, 2016·0 cites·16 claims
- 2748US2025346118A1Monitoring Method for Safe Area and Safety System and Displaying Method ThereofWHETRON ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2848US2024273297A1Entity recognition method, model training method, electronic device, and mediumBEIJING BAIDU NETCOM SCI & TECH CO LTD·Filed 2024·Application pending·0 cites
- 2947US2016351674A1Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 3046US9466535B2Method of forming target patternsUNITED MICROELECTRONICS CORP·Filed 2015·Granted Oct 11, 2016·0 cites·19 claims
- 3144US2016013100A1Via structure and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 3243US10734276B2Planarization methodUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 4, 2020·0 cites·17 claims
- 3343US2015193942A1Automatic alignment system and methodWISTRON CORP·Filed 2014·Application pending·0 cites
- 3443US2015214114A1Manufacturing method of semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 3543US2015140819A1Semiconductor processUNITED MICROELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 3642US10373333B2Interactive clothes and accessories fitting method and display system thereofWISTRON CORP·Filed 2017·Granted Aug 6, 2019·0 cites·25 claims
- 3742US2024273695A1Image recognition method, system and mobile vehicleWHETRON ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3841US2013321773A1Optometric Automatic Test Device and MethodLEE CHENG-CHUNG·Filed 2012·Application pending·0 cites
- 3940US9972498B2Method of fabricating a gate cap layerUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 15, 2018·0 cites·13 claims
- 4039US2015079780A1Method of forming semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 4136US2018033636A1Method of fabricating a semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 4234US2017162402A1Method of manufacturing a semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 4332US2016336269A1Semiconductor structure and process thereofUNITED MICROELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 4431US2003077849A1Method for fabricating ohmic contact layer in semiconductor devicesFiled 2001·Application pending·0 cites
- 4531US2020244885A1Photographing method and electronic apparatusHUAWEI TECH CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →