Inventor · disambiguated record
Yun Li
Also filed as: LI YUN · LI YUN-TSUNG
6 granted patents·2 pending applications·120 citations·filing 1997–2011
85Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0178US6016256AMulti-chip module having interconnect diesPANDA PROJECT·Filed 1997·Granted Jan 18, 2000·44 cites·31 claims
- 0276US6421254B2Multi-chip module having interconnect diesSILICON BANDWIDTH INC·Filed 2001·Granted Jul 16, 2002·19 cites·20 claims
- 0375US6307258B1Open-cavity semiconductor die packageSILICON BANDWIDTH INC·Filed 1998·Granted Oct 23, 2001·38 cites·24 claims
- 0463US6266246B1Multi-chip module having interconnect diesSILICON BANDWIDTH INC·Filed 2000·Granted Jul 24, 2001·9 cites·12 claims
- 0555US6475832B2Open-cavity semiconductor die packageSILICON BANDWIDTH INC·Filed 2001·Granted Nov 5, 2002·5 cites·13 claims
- 0649US6709891B2Open-cavity semiconductor die packageSILICON BANDWIDTH INC·Filed 2002·Granted Mar 23, 2004·5 cites·11 claims
- 0738US2002176238A1Multi-chip module having interconnect diesPANDA PROJECT INC·Filed 2002·Application pending·0 cites
- 0826US2013062111A1Stacked substrate moduleLI HSUN-FA·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yun Li files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →