Inventor · disambiguated record
Yu-Kuang Liao
Also filed as: LIAO YU-KUANG
12 granted patents·3 pending applications·199 citations·filing 2017–2025
91Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD15
Top patents by PatentIndex Score
15 records- 0198US10797031B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 6, 2020·45 cites·20 claims
- 0298US10333623B1Optical transceiverTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 25, 2019·91 cites·20 claims
- 0398US10267990B1Hybrid interconnect device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·33 cites·20 claims
- 0497US11487060B2Semiconductor device with nanostructures aligned with grating coupler and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 1, 2022·5 cites·20 claims
- 0596US10371893B2Hybrid interconnect device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 6, 2019·14 cites·20 claims
- 0695US11774675B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 3, 2023·2 cites·20 claims
- 0787US10914895B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 9, 2021·5 cites·20 claims
- 0885US10665560B2Optical semiconductor package and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 26, 2020·3 cites·18 claims
- 0983US11830861B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 28, 2023·1 cites·20 claims
- 1081US12276838B2Semiconductor device and manufacturing method thereof having grating coupled dies and nanostructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 1180US2025216607A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1275US11830841B2Semiconductor package and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 28, 2023·0 cites·20 claims
- 1374US2023411373A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1468US11322470B2Optical semiconductor package and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 3, 2022·0 cites·20 claims
- 1552US2023352418A1Semiconductor die, semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →