Inventor · disambiguated record
Yu-Shu Lin
Also filed as: LIN YU-SHU
52 granted patents·8 pending applications·216 citations·filing 1993–2025
98Inventor score
Files withUNITED MICROELECTRONICS CORP41DELTA ELECTRONICS INC5HONGFUJIN PREC IND SHENZHEN4HON HAI PREC IND CO LTD2LIN YU-SHU2
Top patents by PatentIndex Score
60 records- 0197US8853060B1Epitaxial processUNITED MICROELECTRONICS CORP·Filed 2013·Granted Oct 7, 2014·44 cites·19 claims
- 0296US11495686B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Nov 8, 2022·4 cites·19 claims
- 0395US11545560B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 3, 2023·4 cites·9 claims
- 0495US9716165B1Field-effect transistor and method of making the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jul 25, 2017·15 cites·13 claims
- 0595US9379182B1Method for forming nanowire and semiconductor device formed with the nanowireUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jun 28, 2016·13 cites·8 claims
- 0694US9673324B1MOS device with epitaxial structure associated with source/drain region and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jun 6, 2017·14 cites·20 claims
- 0789US10943991B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Mar 9, 2021·4 cites·8 claims
- 0889US9722030B1Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 1, 2017·6 cites·12 claims
- 0987US8937369B2Transistor with non-uniform stress layer with stress concentrated regionsUNITED MICROELECTRONICS CORP·Filed 2012·Granted Jan 20, 2015·7 cites·21 claims
- 1084US12300743B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Granted May 13, 2025·0 cites·7 claims
- 1184US12237415B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2023·Granted Feb 25, 2025·0 cites·8 claims
- 1283US9754938B1Semiconductor device and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Sep 5, 2017·3 cites·8 claims
- 1383USD646406SLED PAR lampDELTA ELECTRONICS INC·Filed 2011·Granted Oct 4, 2011·33 cites·1 claims
- 1482US10510609B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Dec 17, 2019·2 cites·1 claims
- 1580US11769833B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2022·Granted Sep 26, 2023·0 cites·9 claims
- 1680US2025241038A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 1779US10643997B2Semiconductor device with metal gatesUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 5, 2020·2 cites·5 claims
- 1878US12021134B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jun 25, 2024·0 cites·14 claims
- 1978US9680022B1Semiconductor device having silicon-germanium layer on fin and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jun 13, 2017·2 cites·9 claims
- 2077US8982257B2Image sensor module and camera module using sameHON HAI PREC IND CO LTD·Filed 2012·Granted Mar 17, 2015·3 cites·7 claims
- 2175US9748386B2Epitaxial structure of semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Aug 29, 2017·2 cites·20 claims
- 2275US2025169119A1Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 2374US9076652B2Semiconductor process for modifying shape of recessUNITED MICROELECTRONICS CORP·Filed 2013·Granted Jul 7, 2015·2 cites·19 claims
- 2473US6386941B1Soft-shelled crystal ballFiled 2000·Granted May 14, 2002·12 cites·2 claims
- 2572US11587835B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Feb 21, 2023·0 cites·7 claims
- 2671US9899498B2Semiconductor device having silicon-germanium layer on fin and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 20, 2018·1 cites·11 claims
- 2770US9214551B2Method for fabricating semiconductor device, and semiconductor device made therebyUNITED MICROELECTRONICS CORP·Filed 2014·Granted Dec 15, 2015·2 cites·6 claims
- 2869US9034705B2Method of forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2013·Granted May 19, 2015·5 cites·19 claims
- 2968USD635292SLED lamp moduleDELTA ELECTRONICS INC·Filed 2010·Granted Mar 29, 2011·18 cites·1 claims
- 3067US9095943B2Apparatus for assembling camera modulesHONGFUJIN PREC IND SHENZHEN·Filed 2012·Granted Aug 4, 2015·2 cites·10 claims
- 3165US11062953B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jul 13, 2021·0 cites·9 claims
- 3264US9268361B2Portable electrical deviceQUANTA COMP INC·Filed 2013·Granted Feb 23, 2016·2 cites·10 claims
- 3360US12406860B2Method of forming conductive layer of semiconductor deviceNANYA TECHNOLOGY CORP·Filed 2022·Granted Sep 2, 2025·0 cites·15 claims
- 3459US10128366B2Field-effect transistorUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 13, 2018·0 cites·15 claims
- 3558US11990547B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted May 21, 2024·0 cites·5 claims
- 3658US9929264B2Field-effect transistor and method of making the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Mar 27, 2018·0 cites·9 claims
- 3757US10446447B2Method for fabricating a curve on sidewalls of a fin-shaped structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 15, 2019·0 cites·7 claims
- 3855US9343573B2Method of fabrication transistor with non-uniform stress layer with stress concentrated regionsUNITED MICROELECTRONICS CORP·Filed 2014·Granted May 17, 2016·0 cites·12 claims
- 3954US8486790B2Manufacturing method for metal gateHUANG PO-CHENG·Filed 2011·Granted Jul 16, 2013·1 cites·13 claims
- 4053US9653549B2Semiconductor device formed with nanowireUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 16, 2017·0 cites·8 claims
- 4152US10056490B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 21, 2018·0 cites·5 claims
- 4252US9966434B2Manufacturing method of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 8, 2018·0 cites·8 claims
- 4352US9272493B2Stamping head used for pressing anisotropic conductive film onto ceramic substrateHONGFUJIN PREC IND SHENZHEN·Filed 2012·Granted Mar 1, 2016·0 cites·8 claims
- 4452US9263579B2Semiconductor process for modifying shape of recessUNITED MICROELECTRONICS CORP·Filed 2015·Granted Feb 16, 2016·0 cites·18 claims
- 4551US9223145B2Device for assembling camera module having anisotropic conductive filmHONGFUJIN PREC IND SHENZHEN·Filed 2013·Granted Dec 29, 2015·0 cites·12 claims
- 4651US8622638B1Protection cap for protecting camera moduleHON HAI PREC IND CO LTD·Filed 2012·Granted Jan 7, 2014·0 cites·4 claims
- 4751USD647641SOmni lampDELTA ELECTRONICS INC·Filed 2011·Granted Oct 25, 2011·7 cites·1 claims
- 4848US9197797B2Camera moduleHONGFUJIN PREC IND SHENZHEN·Filed 2013·Granted Nov 24, 2015·0 cites·8 claims
- 4948US2002150727A1Ornamental water ballFiled 2001·Application pending·0 cites
- 5046US9966468B2Semiconductor device having reverse U-shaped epitaxial layer and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 8, 2018·0 cites·16 claims
Showing the top 50 of 60 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →