Inventor · disambiguated record
Yu-Jie Lin
Also filed as: LIN YU-JIE
3 granted patents·8 pending applications·6 citations·filing 2019–2025
59Inventor score
Top patents by PatentIndex Score
11 records- 0181US11476212B2Semiconductor contact structure having stress buffer layer formed between under bump metal layer and copper pillarUNITED MICROELECTRONICS CORP·Filed 2020·Granted Oct 18, 2022·2 cites·13 claims
- 0277US10903179B2Semiconductor contact structure having stress buffer layer formed between under bump metal layer and copper pillarUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jan 26, 2021·4 cites·18 claims
- 0377US2025286018A1Method of fabricating semiconductor bonding structureUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0477US2025286021A1Semiconductor packageUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0573US2025286019A1Semiconductor packageUNITED MICROELECTORNICS CORP·Filed 2025·Application pending·0 cites
- 0669US2024120316A1Semiconductor package, semiconductor bonding structure, and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 0758US11990836B2Power supply unit and power supply system with dynamic current sharingDELTA ELECTRONICS INC·Filed 2022·Granted May 21, 2024·0 cites·14 claims
- 0853US2024429093A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 0953US2025219031A1Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1052US2025300020A1Dicing method of semiconductor structure and semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1152US2024347503A1Semiconductor structure and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →