Inventor · disambiguated record

Yu-Hsiang Lin

Also filed as: LIN YU-HSIANG

127 granted patents·51 pending applications·221 citations·filing 2004–2025

99Inventor score

Technology areasH10D H10P G06F H10W H04W

Files withUNITED MICROELECTRONICS CORP87 PHISON ELECTRONICS CORP25 HIMAX TECH LTD8 LIN YU HSIANG8 HU LIEH-HSIUNG4

Top patents by PatentIndex Score

178 records

0198US11901239B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Feb 13, 2024·2 cites·12 claims
0298US11062954B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jul 13, 2021·11 cites·5 claims
0397US11721591B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Aug 8, 2023·3 cites·5 claims
0496US10985264B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Apr 20, 2021·9 cites·9 claims
0596US10607882B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Mar 31, 2020·12 cites·9 claims
0696US10249488B1Semiconductor devices with same conductive type but different threshold voltages and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 2, 2019·12 cites·7 claims
0795US12068309B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Aug 20, 2024·2 cites·17 claims
0894US11531589B1Decoding method, memory storage device, and memory control circuit unitPHISON ELECTRONICS CORP·Filed 2021·Granted Dec 20, 2022·3 cites·26 claims
0993US11209919B1Knob device applicable to touch panelHIMAX TECH LTD·Filed 2021·Granted Dec 28, 2021·3 cites·9 claims
1092US10395991B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 27, 2019·7 cites·20 claims
1191US2025113589A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
1290US11495681B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2020·Granted Nov 8, 2022·2 cites·16 claims
1390US11096312B1Heat dissipation apparatus with fanAIC INC·Filed 2020·Granted Aug 17, 2021·3 cites·8 claims
1490US10971397B2Semiconductor device and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Apr 6, 2021·5 cites·19 claims
1590US2024379451A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
1689US2024371703A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
1788US12261086B2Method for integrating high-voltage (HV) device, medium-voltage (MV) device, and low-voltage (LV) deviceUNITED MICROELECTRONICS CORP·Filed 2022·Granted Mar 25, 2025·1 cites·7 claims
1888US12211751B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Jan 28, 2025·0 cites·12 claims
1988US11710778B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jul 25, 2023·1 cites·10 claims
2086US12074070B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Aug 27, 2024·0 cites·7 claims
2186US11152515B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2019·Granted Oct 19, 2021·3 cites·9 claims
2286US10534665B2Decoding method, memory storage device and memory control circuit unitPHISON ELECTRONICS CORP·Filed 2018·Granted Jan 14, 2020·5 cites·24 claims
2385US12094783B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Sep 17, 2024·0 cites·9 claims
2485US2024395909A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
2584US12094956B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Sep 17, 2024·0 cites·8 claims
2684US11146295B1Decoding method, memory storage device, and memory controlling circuit unitPHISON ELECTRONICS CORP·Filed 2020·Granted Oct 12, 2021·2 cites·24 claims
2783US12328898B2High voltage semiconductor device including buried oxide layerUNITED MICROELECTRONICS CORP·Filed 2024·Granted Jun 10, 2025·0 cites·10 claims
2883US12243839B2Bonded semiconductor structure utilizing concave/convex profile design for bonding padsUNITED MICROELECTRONICS CORP·Filed 2024·Granted Mar 4, 2025·0 cites·17 claims
2983US11269898B1Machine learning based database query retrievalA9 COM INC·Filed 2019·Granted Mar 8, 2022·8 cites·20 claims
3083US10636490B1Decoding method, memory control circuit unit and memory storage devicePHISON ELECTRONICS CORP·Filed 2019·Granted Apr 28, 2020·6 cites·24 claims
3183US9380611B2Communication system including a femtocell and communication method thereofLIN YU-HSIANG·Filed 2012·Granted Jun 28, 2016·7 cites·16 claims
3283US2025120161A1Semiconductor device including gate oxide layerUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
3383US2025079363A1Bonded semiconductor structure utilizing concave/convex profileUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
3482US12342599B2Manufacturing method of semiconductor device including gate oxide layerUNITED MICROELECTRONICS CORP·Filed 2024·Granted Jun 24, 2025·0 cites·9 claims
3582US10153265B1Dummy cell arrangement and method of arranging dummy cellsUNITED MICROELECTRONICS CORP·Filed 2017·Granted Dec 11, 2018·3 cites·4 claims
3680US8830750B1Data reading method, and control circuit, memory module and memory storage apparatus using the samePHISON ELECTRONICS CORP·Filed 2013·Granted Sep 9, 2014·7 cites·20 claims
3780US7897602B2Indolinone compounds as kinase inhibitorsDEV CENTER BIOTECHNOLOGY·Filed 2009·Granted Mar 1, 2011·9 cites·40 claims
3879US9935606B1System on chip and correction method of termination impedance element thereofALI CORP·Filed 2016·Granted Apr 3, 2018·3 cites·14 claims
3978US11935854B2Method for forming bonded semiconductor structure utilizing concave/convex profile design for bonding padsUNITED MICROELECTRONICS CORP·Filed 2023·Granted Mar 19, 2024·0 cites·6 claims
4078US10529825B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jan 7, 2020·2 cites·18 claims
4178US9274891B2Decoding method, memory storage device, and memory controlling circuit unitPHISON ELECTRONICS CORP·Filed 2014·Granted Mar 1, 2016·6 cites·18 claims
4277US12211915B2Semiconductor device including gate oxide layerUNITED MICROELECTRONICS CORP·Filed 2023·Granted Jan 28, 2025·0 cites·10 claims
4377US11600531B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Mar 7, 2023·0 cites·12 claims
4477US10067824B2Error processing method, memory storage device and memory controlling circuit unitPHISON ELECTRONICS CORP·Filed 2014·Granted Sep 4, 2018·4 cites·36 claims
4577US9529666B2Decoding method, memory storage device and memory controlling circuit unitPHISON ELECTRONICS CORP·Filed 2014·Granted Dec 27, 2016·6 cites·18 claims
4676US12211214B2Image processing circuit and image processing method for blurring an imageSIGMASTAR TECHNOLOGY LTD·Filed 2022·Granted Jan 28, 2025·1 cites·13 claims
4776US12057483B2Semiconductor device including gate oxide layer and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Aug 6, 2024·0 cites·6 claims
4876US12040396B2High voltage semiconductor device including buried oxide layerUNITED MICROELECTRONICS CORP·Filed 2023·Granted Jul 16, 2024·0 cites·9 claims
4976US9268634B2Decoding method, memory storage device and memory controlling circuit unitPHISON ELECTRONICS CORP·Filed 2013·Granted Feb 23, 2016·4 cites·30 claims
5075US11557654B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 17, 2023·0 cites·14 claims

Showing the top 50 of 178 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →