Inventor · disambiguated record
Yu-Hung Lin
Also filed as: LIN YU · LIN YU-HUNG
105 granted patents·51 pending applications·862 citations·filing 2001–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD76KUANG YING COMP EQUIPMENT CO14NXP BV12TAIWAN SEMICONDUCTOR MFG11LIN YU-HUNG9
Top patents by PatentIndex Score
156 records- 0198US11482497B2Package structure including a first die and a second die and a bridge die and method of forming the package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 25, 2022·7 cites·20 claims
- 0298US9831183B2Contact structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 28, 2017·493 cites·20 claims
- 0397US12033949B2Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 9, 2024·3 cites·20 claims
- 0497US9576908B1Interconnection structure, fabricating method thereof, and semiconductor device using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 21, 2017·14 cites·20 claims
- 0595US11682625B2Interconnection structure, fabricating method thereof, and semiconductor device using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 20, 2023·2 cites·20 claims
- 0695US9230795B1Directional pre-clean in silicide and contact formationTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jan 5, 2016·24 cites·20 claims
- 0794US11664774B2Operational amplifier using single-stage amplifier with slew-rate enhancement and associated methodMEDIATEK INC·Filed 2022·Granted May 30, 2023·2 cites·12 claims
- 0894US9735050B2Composite contact plug structure and method of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 15, 2017·8 cites·20 claims
- 0994US9721896B2Interconnection structure, fabricating method thereof, and semiconductor device using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 1, 2017·8 cites·20 claims
- 1093US10830867B2Radar unit, integrated circuit and methods for detecting and mitigating mutual interferenceNXP BV·Filed 2018·Granted Nov 10, 2020·24 cites·16 claims
- 1192US10858200B1Object orientation device, object orientation and printing system and method for use thereofRONG CHANG METAL CO LTD·Filed 2020·Granted Dec 8, 2020·7 cites·15 claims
- 1292US10099269B1Drawing deviceLIN YU HUNG·Filed 2017·Granted Oct 16, 2018·8 cites·9 claims
- 1391US10297548B2Interconnection structure, fabricating method thereof, and semiconductor device using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 21, 2019·4 cites·20 claims
- 1491US8854848B1Power supplying device having programmable current-balancing controlETASIS ELECTRONICS CORP·Filed 2013·Granted Oct 7, 2014·13 cites·10 claims
- 1591US8722531B1Barrier layer for copper interconnectTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted May 13, 2014·13 cites·21 claims
- 1690US11450612B2Semiconductor devices and methods of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 20, 2022·2 cites·14 claims
- 1790US9601883B1USB connectorKUANG YING COMP EQUIPMENT CO·Filed 2015·Granted Mar 21, 2017·11 cites·17 claims
- 1889US10756017B2Contact structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 25, 2020·4 cites·20 claims
- 1987US10790850B1Signal amplitude aware dithering method for enhancing small signal linearity in an analog-to-digital converterNXP BV·Filed 2019·Granted Sep 29, 2020·8 cites·20 claims
- 2087US9984924B2Semiconductor device and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 29, 2018·3 cites·20 claims
- 2187US2025357724A1Optical package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2286US11437745B2Card connectorV GENERAL TECH CO LTD·Filed 2021·Granted Sep 6, 2022·3 cites·10 claims
- 2386US10469095B2Successive approximation register analog-to-digital converter, electronic device and method thereforNXP BV·Filed 2018·Granted Nov 5, 2019·7 cites·20 claims
- 2486US9368357B2Directional pre-clean in silicide and contact formationTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 14, 2016·4 cites·20 claims
- 2585US12341104B2Methods of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 24, 2025·0 cites·20 claims
- 2685US9589892B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 7, 2017·4 cites·20 claims
- 2785US8777672B2USB female connectorKUANG YING COMP EQUIPMENT CO·Filed 2012·Granted Jul 15, 2014·15 cites·10 claims
- 2884US11854874B2Metal contact structure and method of forming the same in a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 26, 2023·1 cites·19 claims
- 2984US11385321B2Radar unit, integrated circuit and methods for detecting and mitigating mutual interferenceNXP BV·Filed 2018·Granted Jul 12, 2022·10 cites·20 claims
- 3084US10983193B2Communication unit, integrated circuits and methods for cascading integrated circuitsNXP BV·Filed 2018·Granted Apr 20, 2021·7 cites·18 claims
- 3184US2025285981A1Semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3284US2025286344A1Optical package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3383US10276432B2Composite contact plug structure and method of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 30, 2019·2 cites·19 claims
- 3483US9350375B1Method and system for performing analog-to-digital conversionNXP BV·Filed 2015·Granted May 24, 2016·6 cites·20 claims
- 3583US9147979B1Electric connectorKUANG YING COMP EQUIPMENT CO·Filed 2014·Granted Sep 29, 2015·15 cites·21 claims
- 3682US11749603B2Interconnection structure, fabricating method thereof, and semiconductor device using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 5, 2023·0 cites·20 claims
- 3782US8662936B2USB female connectorKUANG YING COMP EQUIPMENT CO·Filed 2012·Granted Mar 4, 2014·12 cites·14 claims
- 3882US2025309608A1Semiconductor Device and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3980US10170898B1Signal leakage proof housing for signal distributorsSIGNAL CABLE SYSTEM CO LTD·Filed 2018·Granted Jan 1, 2019·3 cites·8 claims
- 4080US9966304B2Method for forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 8, 2018·3 cites·20 claims
- 4180US9385080B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 5, 2016·4 cites·20 claims
- 4280US8872342B2Barrier layer for copper interconnectTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Oct 28, 2014·4 cites·22 claims
- 4380US2025355175A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4480US2025357235A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4579US9793204B2Method of manufacturing semiconductor structure comprising plurality of through holes using metal hard maskTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 17, 2017·2 cites·20 claims
- 4679US9385481B2Electronic connectorKUANG YING COMP EQUIPMENT CO·Filed 2014·Granted Jul 5, 2016·10 cites·9 claims
- 4779US2025164690A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4878US8827750B2Application structure for electric wave effect of transmission conductorKUANG YING COMP EQUIPMENT CO·Filed 2012·Granted Sep 9, 2014·10 cites·8 claims
- 4978US2024332202A1Package structure with bridge die and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 5077US11935836B2Semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 19, 2024·0 cites·20 claims
Showing the top 50 of 156 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →