Inventor · disambiguated record
Yuan-Yu Lin
Also filed as: LIN YUAN-YU
3 granted patents·8 pending applications·7 citations·filing 2007–2025
54Inventor score
Files withCAPXON ELECTRONIC TECH CO LTD3HONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD3ASUSTEK COMP INC2AVARY HOLDING SHENZHEN CO LTD1HON HAI PREC IND CO LTD1
Top patents by PatentIndex Score
11 records- 0169US8004761B2Stereo projection optical systemHON HAI PREC IND CO LTD·Filed 2007·Granted Aug 23, 2011·7 cites·7 claims
- 0265US2025226160A1Thin and high-capacity multilayer solid aluminum electrolytic capacitorCAPXON ELECTRONIC TECH CO LTD·Filed 2025·Application pending·0 cites
- 0362US2025218696A1Ultra-thin solid aluminum electrolytic capacitorCAPXON ELECTRONIC TECH CO LTD·Filed 2025·Application pending·0 cites
- 0457US2025365872A1Circuit board and manufacturing method thereofHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2024·Application pending·0 cites
- 0556US12167553B2PCI-E expansion card moduleASUSTEK COMP INC·Filed 2022·Granted Dec 10, 2024·0 cites·10 claims
- 0653US2024098908A1Circuit board connection structure and preparation method thereforHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2023·Application pending·0 cites
- 0751US2024213036A1Chip packaging structure and method for packaging the chipAVARY HOLDING SHENZHEN CO LTD·Filed 2023·Application pending·0 cites
- 0850US2023268681A1Expansion card assembly and connectorASUSTEK COMP INC·Filed 2022·Application pending·0 cites
- 0948US2025022668A1Multilayer polymer capacitor (mlpc) with multiple electroplated terminalsCAPXON ELECTRONIC TECH CO LTD·Filed 2024·Application pending·0 cites
- 1047US11864329B2Packaging structure with embedded electronic components and method for manufacturing the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2022·Granted Jan 2, 2024·0 cites·13 claims
- 1127US2016118243A1Methods for preparing a titanium oxide film and a composite film comprising the sameUNIV NAT TAIWAN·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →