Inventor · disambiguated record
Yu-Te Lu
Also filed as: LU YU-TE
21 granted patents·9 pending applications·44 citations·filing 2003–2019
91Inventor score
Top patents by PatentIndex Score
30 records- 0189US9831167B1Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereofKINSUS INTERCONNECT TECH CORP·Filed 2017·Granted Nov 28, 2017·7 cites·18 claims
- 0288US9301405B1Method for manufacturing microthrough-hole in circuit board and circuit board structure with microthrough-holeKINSUS INTERCONNECT TECH CORP·Filed 2015·Granted Mar 29, 2016·10 cites·7 claims
- 0385US9198296B1Double sided board with buried element and method for manufacturing the sameKINSUS INTERCONNECT TECH CORP·Filed 2015·Granted Nov 24, 2015·7 cites·8 claims
- 0476US7875809B2Method of fabricating board having high density core layer and structure thereofKINSUS INTERCONNECT TECH CORP·Filed 2007·Granted Jan 25, 2011·8 cites·1 claims
- 0575US9406641B2Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereofKINSUS INTERCONNECT TECH CORP·Filed 2013·Granted Aug 2, 2016·3 cites·8 claims
- 0672US8083954B2Method for fabricating component-embedded printed circuit boardCHANG CHIEN-WEI·Filed 2008·Granted Dec 27, 2011·5 cites·8 claims
- 0766US7871892B2Method for fabricating buried capacitor structureKINSUS INTERCONNECT TECH CORP·Filed 2009·Granted Jan 18, 2011·3 cites·3 claims
- 0865US10334719B2Multi-layer circuit board capable of being applied with electrical testing and method for manufacturing the sameKINSUS INTERCONNECT TECH CORP·Filed 2017·Granted Jun 25, 2019·1 cites·18 claims
- 0957US11044806B2Method for manufacturing multi-layer circuit board capable of being applied with electrical testingKINSUS INTERCONNECT TECH CORP·Filed 2019·Granted Jun 22, 2021·0 cites·20 claims
- 1052US10548214B2Multi-layer circuit board capable of being applied with electrical testing and method for manufacturing the sameKINSUS INTERCONNECT TECH CORP·Filed 2017·Granted Jan 28, 2020·0 cites·20 claims
- 1151US9095084B2Stacked multilayer structureKINSUS INTERCONNECT TECH CORP·Filed 2013·Granted Jul 28, 2015·0 cites·4 claims
- 1250US10455694B2Method for manufacturing a multi-layer circuit board capable of being applied with electrical testingKINSUS INTERCONNECT TECH CORP·Filed 2019·Granted Oct 22, 2019·0 cites·20 claims
- 1350US9370110B2Method of manufacturing a multilayer substrate structure for fine lineKINSUS INTERCONNECT TECH CORP·Filed 2014·Granted Jun 14, 2016·0 cites·7 claims
- 1450US2015282306A1Multilayer substrate structure for fine lineKINSUS INTERCONNECT TECH CORP·Filed 2014·Application pending·0 cites
- 1549US9095085B2Method of manufacturing a stacked multilayer structureKINSUS INTERCONNECT TECH CORP·Filed 2013·Granted Jul 28, 2015·0 cites·8 claims
- 1649US2010075497A1Non-Plating Line Plating Method Using Current Transmitted From Ball SideCHANG CHIEN-WEI·Filed 2008·Application pending·0 cites
- 1749US2010075495A1Method Of Selectively Plating Without Plating LinesCHANG CHIEN-WEI·Filed 2008·Application pending·0 cites
- 1847US2010283145A1Stack structure with copper bumpsCHANG CHIEN-WEI·Filed 2009·Application pending·0 cites
- 1947US2011048777A1Component-Embedded Printed Circuit BoardCHANG CHIEN-WEI·Filed 2009·Application pending·0 cites
- 2046US9754870B2Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereofKINSUS INTERCONNECT TECH CORP·Filed 2016·Granted Sep 5, 2017·0 cites·4 claims
- 2146US8875390B2Method of manufacturing a laminate circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2012·Granted Nov 4, 2014·0 cites·6 claims
- 2245US8186054B2Method of fabricating board having high density core layer and structure thereofCHANG CHIEN-WEI·Filed 2010·Granted May 29, 2012·0 cites·7 claims
- 2345US8161639B2Method for fabricating an interlayer conducting structure of an embedded circuitryCHANG CHIEN-WEI·Filed 2010·Granted Apr 24, 2012·0 cites·6 claims
- 2445US2014116755A1Laminate circuit board structureKINSUS INTERCONNECT TECH CORP·Filed 2012·Application pending·0 cites
- 2545US2004169744A1Image-sensing device for auto-judging exposure timeFiled 2003·Application pending·0 cites
- 2643US8766102B2Chip support board structureKINSUS INTERCONNECT TECH CORP·Filed 2012·Granted Jul 1, 2014·0 cites·8 claims
- 2743US2010309608A1Buried Capacitor StructureCHANG CHIEN-WEI·Filed 2009·Application pending·0 cites
- 2842US8941224B2Package structure of a chip and a substrateKINSUS INTERCONNECT TECH CORP·Filed 2013·Granted Jan 27, 2015·0 cites·4 claims
- 2940US8887386B2Method of manufacturing a chip support board structureKINSUS INTERCONNECT TECH CORP·Filed 2012·Granted Nov 18, 2014·0 cites·6 claims
- 3040US2014295623A1Method of packaging a chip and a substrateKINSUS INTERCONNECT TECH CORP·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →