Inventor · disambiguated record
Yukinobu Mikado
Also filed as: MIKADO YUKINOBU
39 granted patents·5 pending applications·519 citations·filing 1998–2020
98Inventor score
Top patents by PatentIndex Score
44 records- 0196US8101868B2Multilayered printed circuit board and method for manufacturing the sameITO SOTARO·Filed 2006·Granted Jan 24, 2012·37 cites·32 claims
- 0296US7834273B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2006·Granted Nov 16, 2010·41 cites·41 claims
- 0395US7759582B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2006·Granted Jul 20, 2010·29 cites·31 claims
- 0495US7423219B2Flex-rigid wiring boardIBIDEN CO LTD·Filed 2005·Granted Sep 9, 2008·132 cites·10 claims
- 0594US7957154B2Multilayer printed circuit boardIBIDEN CO LTD·Filed 2006·Granted Jun 7, 2011·26 cites·12 claims
- 0693US8785788B2Wiring board with built-in electronic component and method for manufacturing the sameSHIMIZU KEISUKE·Filed 2011·Granted Jul 22, 2014·17 cites·22 claims
- 0792US8829357B2Wiring board and method for manufacturing the sameMIKADO YUKINOBU·Filed 2011·Granted Sep 9, 2014·17 cites·18 claims
- 0892US7929313B2Method of manufacturing multilayer printed circuit boardIBIDEN CO LTD·Filed 2009·Granted Apr 19, 2011·17 cites·2 claims
- 0991US8320135B2Multilayer printed circuit boardITO SOTARO·Filed 2011·Granted Nov 27, 2012·10 cites·8 claims
- 1091US8168893B2Multilayer wiring board with concave portion for accomodating electronic componentITO SOTARO·Filed 2008·Granted May 1, 2012·23 cites·9 claims
- 1191US8093502B2Flex-rigid wiring board and manufacturing method thereofMIKADO YUKINOBU·Filed 2005·Granted Jan 10, 2012·31 cites·26 claims
- 1289US9027238B2Multilayered printed circuit board and method for manufacturing the sameITO SOTARO·Filed 2011·Granted May 12, 2015·8 cites·3 claims
- 1387US10143092B2Circuit substrate and method for manufacturing the sameIBIDEN CO LTD·Filed 2016·Granted Nov 27, 2018·6 cites·20 claims
- 1487US6242079B1Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 1998·Granted Jun 5, 2001·67 cites·16 claims
- 1585US9215805B2Wiring board with built-in electronic component and method for manufacturing the sameIBIDEN CO LTD·Filed 2013·Granted Dec 15, 2015·8 cites·17 claims
- 1684US8692132B2Multilayered printed circuit board and method for manufacturing the sameITO SOTARO·Filed 2011·Granted Apr 8, 2014·5 cites·20 claims
- 1784US7973249B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2010·Granted Jul 5, 2011·6 cites·5 claims
- 1880US9232656B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Granted Jan 5, 2016·4 cites·21 claims
- 1980US8481424B2Multilayer printed wiring boardTAKAHASHI MICHIMASA·Filed 2011·Granted Jul 9, 2013·4 cites·20 claims
- 2080US8212363B2Multilayer printed wiring boardTAKAHASHI MICHIMASA·Filed 2010·Granted Jul 3, 2012·4 cites·20 claims
- 2178US9439289B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2012·Granted Sep 6, 2016·4 cites·20 claims
- 2278US8705248B2Multilayer printed circuit boardITO SOTARO·Filed 2012·Granted Apr 22, 2014·3 cites·9 claims
- 2377US9044830B2Method for forming cavity, apparatus for forming cavity, method for manufacturing circuit board, and circuit boardIBIDEN CO LTD·Filed 2013·Granted Jun 2, 2015·3 cites·20 claims
- 2477US8908387B2Wiring board and method for manufacturing the sameMIKADO YUKINOBU·Filed 2012·Granted Dec 9, 2014·3 cites·19 claims
- 2575US8693209B2Wiring board and method for manufacturing the sameMIKADO YUKINOBU·Filed 2012·Granted Apr 8, 2014·3 cites·21 claims
- 2673US8973259B2Method for manufacturing a multilayered circuit boardITO SOTARO·Filed 2011·Granted Mar 10, 2015·2 cites·17 claims
- 2772US9831163B2Circuit substrate and method for manufacturing the sameIBIDEN CO LTD·Filed 2016·Granted Nov 28, 2017·2 cites·20 claims
- 2871US9204552B2Printed wiring boardIBIDEN CO LTD·Filed 2012·Granted Dec 1, 2015·3 cites·20 claims
- 2969US9119322B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Granted Aug 25, 2015·1 cites·20 claims
- 3066US8912451B2Multilayered printed circuit board and method for manufacturing the sameITO SOTARO·Filed 2012·Granted Dec 16, 2014·1 cites·14 claims
- 3159US9320148B2Printed wiring boardMIKADO YUKINOBU·Filed 2012·Granted Apr 19, 2016·1 cites·11 claims
- 3259US8891245B2Printed wiring boardFURUTANI TOSHIKI·Filed 2012·Granted Nov 18, 2014·1 cites·19 claims
- 3357US8621748B2Manufacturing method for a printed wiring boardTAKAHASHI MICHIMASA·Filed 2009·Granted Jan 7, 2014·0 cites·20 claims
- 3454US7902463B2Printed wiring board and method of manufacturing the sameIBIDEN CO LTD·Filed 2007·Granted Mar 8, 2011·0 cites·26 claims
- 3553US8181341B2Method of forming a multilayer printed wiring board having a bulged viaTAKAHASHI MICHIMASA·Filed 2009·Granted May 22, 2012·0 cites·18 claims
- 3650US2008107802A1Flex-rigid wiring boardIBIDEN CO LTD·Filed 2007·Application pending·0 cites
- 3747US9883592B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Jan 30, 2018·0 cites·20 claims
- 3843US9332657B2Multilayer printed wiring board and method for manufacturing multilayer printed wiring boardFURUTANI TOSHIKI·Filed 2012·Granted May 3, 2016·0 cites·4 claims
- 3943US8957320B2Printed wiring boardFURUTANI TOSHIKI·Filed 2012·Granted Feb 17, 2015·0 cites·19 claims
- 4043US2011240354A1Wiring board and method for manufacturing wiring boardIBIDEN CO LTD·Filed 2011·Application pending·0 cites
- 4143US2019104615A1Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2018·Application pending·0 cites
- 4242US2013256007A1Wiring board with built-in electronic component and method for manufacturing the sameIBIDEN CO LTD·Filed 2012·Application pending·0 cites
- 4339US2012188734A1Wiring board and method for manufacturing the sameMIKADO YUKINOBU·Filed 2011·Application pending·0 cites
- 4437US11277923B2Printed wiring board and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2020·Granted Mar 15, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →