Inventor · disambiguated record
Yuji Mimura
Also filed as: MIMURA YUJI
12 granted patents·4 pending applications·17 citations·filing 2014–2024
84Inventor score
Files withTOKYO ELECTRON LTD16
Top patents by PatentIndex Score
16 records- 0183US10340248B2Bonding systemsTOKYO ELECTRON LTD·Filed 2017·Granted Jul 2, 2019·4 cites·10 claims
- 0282US9741595B2Bonding method, storage medium, bonding apparatus and bonding systemTOKYO ELECTRON LTD·Filed 2015·Granted Aug 22, 2017·6 cites·12 claims
- 0381US11424142B2Bonding system with cleaning apparatus for cleaning non-bonding surface of substrateTOKYO ELECTRON LTD·Filed 2020·Granted Aug 23, 2022·1 cites·11 claims
- 0476US9401291B2Coating apparatusTOKYO ELECTRON LTD·Filed 2014·Granted Jul 26, 2016·6 cites·10 claims
- 0572US11626302B2Bonding method for cleaning non-bonding surface of substrateTOKYO ELECTRON LTD·Filed 2022·Granted Apr 11, 2023·0 cites·9 claims
- 0659US12157293B2Separating method, separating apparatus, and separating systemTOKYO ELECTRON LTD·Filed 2022·Granted Dec 3, 2024·0 cites·3 claims
- 0759US2025029950A1Bonding method and bonding systemTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0854US12480884B2Analysis apparatus, bonding system, and analysis methodTOKYO ELECTRON LTD·Filed 2023·Granted Nov 25, 2025·0 cites·9 claims
- 0954US12469685B2Surface modifying apparatus and bonding strength determination methodTOKYO ELECTRON LTD·Filed 2022·Granted Nov 11, 2025·0 cites·7 claims
- 1054US12394749B2Bonding system and surface modification methodTOKYO ELECTRON LTD·Filed 2022·Granted Aug 19, 2025·0 cites·7 claims
- 1150US2024194478A1Apparatus and methods for processing bonding semiconductor wafersTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 1250US2024079214A1Surface modifying method and surface modifying apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 1347US12451374B2Bonding system and inspection method of inspecting combined substrateTOKYO ELECTRON LTD·Filed 2020·Granted Oct 21, 2025·0 cites·10 claims
- 1447US2024170444A1Bonding layer and processTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1546US11315789B2Method and structure for low density silicon oxide for fusion bonding and debondingTOKYO ELECTRON LTD·Filed 2019·Granted Apr 26, 2022·0 cites·20 claims
- 1637US11791182B2Measuring method and measuring deviceTOKYO ELECTRON LTD·Filed 2019·Granted Oct 17, 2023·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →