Inventor · disambiguated record
Yusuke Nagai
Also filed as: NAGAI YUSUKE
80 granted patents·63 pending applications·547 citations·filing 2003–2025
99Inventor score
Top patents by PatentIndex Score
143 records- 0198US7435607B2Method of wafer laser processing using a gas permeable protective tapeDISCO CORP·Filed 2005·Granted Oct 14, 2008·113 cites·3 claims
- 0296US11433377B2Exhaust gas purification catalyst and production method thereforMITSUI MINING & SMELTING CO LTD·Filed 2020·Granted Sep 6, 2022·6 cites·10 claims
- 0396US7364986B2Laser beam processing method and laser beam machineDISCO CORP·Filed 2004·Granted Apr 29, 2008·121 cites·5 claims
- 0494US11266982B2Exhaust gas purification catalystMITSUI MINING & SMELTING CO LTD·Filed 2019·Granted Mar 8, 2022·11 cites·3 claims
- 0594US11208931B2Exhaust gas purification catalystMITSUI MINING & SMELTING CO LTD·Filed 2019·Granted Dec 28, 2021·7 cites·5 claims
- 0694US11097260B2Exhaust gas purification deviceMITSUI MINING & SMELTING CO·Filed 2019·Granted Aug 24, 2021·11 cites·3 claims
- 0794US7708538B2Oil free screw compressorHITACHI IND EQUIPMENT SYS·Filed 2007·Granted May 4, 2010·20 cites·8 claims
- 0891US11810704B2Multilayer coil componentTDK CORP·Filed 2019·Granted Nov 7, 2023·4 cites·8 claims
- 0991US7682858B2Wafer processing method including formation of a deteriorated layerDISCO CORP·Filed 2005·Granted Mar 23, 2010·18 cites·8 claims
- 1091US7223937B2Laser beam processing method and laser beam processing machineDISCO CORP·Filed 2005·Granted May 29, 2007·14 cites·13 claims
- 1191US7179722B2Wafer dividing methodDISCO CORP·Filed 2005·Granted Feb 20, 2007·20 cites·5 claims
- 1288US11679815B2Liquid discharge structureYAZAKI CORP·Filed 2020·Granted Jun 20, 2023·2 cites·12 claims
- 1386US7329564B2Wafer dividing methodDISCO CORP·Filed 2005·Granted Feb 12, 2008·12 cites·4 claims
- 1485US12087484B2Multilayer coil componentTDK CORP·Filed 2023·Granted Sep 10, 2024·0 cites·5 claims
- 1585US8729032B2Self-assembling peptide and peptide gel with high strengthNAGAI YUSUKE·Filed 2010·Granted May 20, 2014·12 cites·13 claims
- 1684US7063083B2Wafer dividing method and apparatusDISCO CORP·Filed 2005·Granted Jun 20, 2006·8 cites·7 claims
- 1783US12444530B2Multilayer coil componentTDK CORP·Filed 2023·Granted Oct 14, 2025·0 cites·11 claims
- 1883US10126229B2Optical measurement deviceSHIMADZU CORP·Filed 2015·Granted Nov 13, 2018·2 cites·7 claims
- 1983US9797826B2Optical analyzerSHIMADZU CORP·Filed 2015·Granted Oct 24, 2017·2 cites·3 claims
- 2083US8313312B2Screw compressorFUJIMOTO HIDEKI·Filed 2009·Granted Nov 20, 2012·7 cites·20 claims
- 2181US11913367B2Exhaust gas purification catalystMITSUI MINING & SMELTING CO LTD·Filed 2019·Granted Feb 27, 2024·1 cites·7 claims
- 2281US7618878B2Wafer dividing methodDISCO CORP·Filed 2008·Granted Nov 17, 2009·6 cites·2 claims
- 2381US7470566B2Wafer dividing methodDISCO CORP·Filed 2006·Granted Dec 30, 2008·6 cites·2 claims
- 2480US7715030B2Printing apparatus and print restrictions management system for inquiring whether changing print restrictions is authorizedSHARP KK·Filed 2005·Granted May 11, 2010·16 cites·15 claims
- 2579US7497213B2Wafer dividing apparatusDISCO CORP·Filed 2005·Granted Mar 3, 2009·6 cites·6 claims
- 2679US7350446B2Wafer dividing apparatusDISCO CORP·Filed 2005·Granted Apr 1, 2008·6 cites·5 claims
- 2778US11302466B2Multilayer coil electronic componentTDK CORP·Filed 2018·Granted Apr 12, 2022·1 cites·13 claims
- 2877US7141443B2Semiconductor wafer dividing method utilizing laser beamDISCO CORP·Filed 2004·Granted Nov 28, 2006·19 cites·10 claims
- 2976US10041914B1Degassing deviceSHIMADZU CORP·Filed 2017·Granted Aug 7, 2018·1 cites·4 claims
- 3076US8951974B2Self-assembling peptide and peptide gel with high strengthNAGAI YUSUKE·Filed 2014·Granted Feb 10, 2015·3 cites·14 claims
- 3176US7348199B2Wafer dividing methodDISCO CORP·Filed 2005·Granted Mar 25, 2008·5 cites·6 claims
- 3275US7549560B2Wafer dividing methodDISCO CORP·Filed 2005·Granted Jun 23, 2009·6 cites·2 claims
- 3374US12243675B2Multilayer coil componentTDK CORP·Filed 2021·Granted Mar 4, 2025·0 cites·6 claims
- 3474US9877368B2Optical analyzerSHIMADZU CORP·Filed 2016·Granted Jan 23, 2018·1 cites·3 claims
- 3573US7449396B2Wafer dividing methodDISCO CORP·Filed 2005·Granted Nov 11, 2008·4 cites·3 claims
- 3673US2025157724A1Multilayer coil componentTDK CORP·Filed 2025·Application pending·0 cites
- 3772US11710593B2Multilayer coil componentTDK CORP·Filed 2020·Granted Jul 25, 2023·0 cites·4 claims
- 3872US11605483B2Composite magnetic body and electronic componentTDK CORP·Filed 2021·Granted Mar 14, 2023·0 cites·6 claims
- 3972US7179721B2Method of dividing a non-metal substrateDISCO CORP·Filed 2004·Granted Feb 20, 2007·14 cites·10 claims
- 4071US11824321B2Method of fabricating tubular laser light source, tubular laser light source and detection device using tubular laser light sourceSHIMADZU CORP·Filed 2022·Granted Nov 21, 2023·0 cites·3 claims
- 4171US7232741B2Wafer dividing methodDISCO CORP·Filed 2004·Granted Jun 19, 2007·13 cites·5 claims
- 4270US12300409B2Multilayer coil device and method of manufacturing the sameTDK CORP·Filed 2022·Granted May 13, 2025·0 cites·5 claims
- 4369US12456567B2Multilayer coil componentTDK CORP·Filed 2022·Granted Oct 28, 2025·0 cites·8 claims
- 4469US2025050300A1Synthesis systemSHIMADZU CORP·Filed 2024·Application pending·0 cites
- 4569US2024294707A1Compound, composition, surface treatment agent, coating liquid, article, and method for producing articleAGC INC·Filed 2024·Application pending·0 cites
- 4668US2025355967A1Data processing device and data processing methodMITSUBISHI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 4768US2025246349A1Coil componentTDK CORP·Filed 2024·Application pending·0 cites
- 4867US7553777B2Silicon wafer laser processing method and laser beam processing machineDISCO CORP·Filed 2005·Granted Jun 30, 2009·2 cites·4 claims
- 4967US7179724B2Wafer processing methodDISCO CORP·Filed 2004·Granted Feb 20, 2007·11 cites·9 claims
- 5066US12392689B2Online sampling systemSHIMADZU CORP·Filed 2023·Granted Aug 19, 2025·0 cites·10 claims
Showing the top 50 of 143 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →