Inventor · disambiguated record
Yuta Nakane
Also filed as: NAKANE YUTA
4 granted patents·19 pending applications·1 citations·filing 2020–2025
56Inventor score
Files withTOKYO ELECTRON LTD23
Top patents by PatentIndex Score
23 records- 0182US12112954B2Etching method, substrate processing apparatus, and substrate processing systemTOKYO ELECTRON LTD·Filed 2021·Granted Oct 8, 2024·1 cites·20 claims
- 0271US2025174466A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0371US2025164886A1Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0462US2025349519A1Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0559US12431335B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Sep 30, 2025·0 cites·21 claims
- 0659US2025166976A1Dry-developing resist film formed of metal-containing resistTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0758US2025051915A1Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0858US2024112922A1Etching method and plasma processing systemTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 0958US2025308926A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1058US2025314971A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1157US2024165677A1Method for cleaning chamber or component, substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1257US2025264805A1Substrate processing method, composition for forming metal-containing resist, metal-containing resist, and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1356US2024112918A1Plasma processing system, plasma processing apparatus, and etching methodTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1456US2025284198A1Dry development method and dry development apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1555US2024128092A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1654US11476123B2Etching method, plasma processing apparatus, and substrate processing systemTOKYO ELECTRON LTD·Filed 2020·Granted Oct 18, 2022·0 cites·19 claims
- 1754US2025226222A1Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1854US2025226223A1Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1954US2025224683A1Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 2053US2025236951A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 2153US2025210328A1Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 2253US2023058079A1Etching method, plasma processing apparatus, and substrate processing systemTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 2352US12100578B2Substrate processing methodTOKYO ELECTRON LTD·Filed 2021·Granted Sep 24, 2024·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →