Inventor · disambiguated record
Yutaka Noda
Also filed as: NODA YUTAKA
21 granted patents·14 pending applications·174 citations·filing 1991–2024
95Inventor score
Files withFUJITSU LTD23FUNAI ELECTRIC CO4YAMASA CORP2FUJITSU LTD KAWASAKI JAPAN1MATSUSHITA ELECTRIC INDUSTRIAL CO LTD1
Top patents by PatentIndex Score
35 records- 0183US6361626B1Solder alloy and soldered bondFUJITSU LTD·Filed 2001·Granted Mar 26, 2002·19 cites·4 claims
- 0277US7304658B2Thermal printer and method for correcting the energizing time data for heating elements in the thermal printerFUNAI ELECTRIC CO·Filed 2005·Granted Dec 4, 2007·6 cites·8 claims
- 0375US8137015B2Image forming method for determining a position of an ink ribbon with a boundary lineNODA YUTAKA·Filed 2006·Granted Mar 20, 2012·6 cites·5 claims
- 0470US6617444B1Dinucleotide tetraphosphate crystalsYAMASA CORP·Filed 2000·Granted Sep 9, 2003·4 cites·14 claims
- 0569US6541898B2Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding methodFUJITSU LTD·Filed 2001·Granted Apr 1, 2003·14 cites·7 claims
- 0669US2024367432A1Droplet dispensing device and control methodFUNAI ELECTRIC CO·Filed 2024·Application pending·0 cites
- 0767US7691662B2Optical module producing method and apparatusFUJITSU LTD·Filed 2007·Granted Apr 6, 2010·1 cites·9 claims
- 0866US6467141B2Method of assembling micro-actuatorFUJITSU LTD·Filed 2001·Granted Oct 22, 2002·12 cites·14 claims
- 0962US7717317B2Ball capturing apparatus, solder ball disposing apparatus, ball capturing method, and solder ball disposing methodFUJITSU LTD·Filed 2007·Granted May 18, 2010·2 cites·19 claims
- 1061US5156237AElevator landing door apparatusMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Oct 20, 1992·20 cites·2 claims
- 1159US5751584AMethod for checking interference, method for checking processing program, and method for checking processing proprietyTOSHIBA MACHINE CO LTD·Filed 1995·Granted May 12, 1998·28 cites·10 claims
- 1258US6107181AMethod of forming bumps and template used for forming bumpsFUJITSU LTD·Filed 1998·Granted Aug 22, 2000·17 cites·9 claims
- 1357US2015118447A1Component assembly manufacturing method, positioning apparatus, and component assemblyFUJITSU LTD·Filed 2014·Application pending·0 cites
- 1456US2013233494A1Component adhesive bonding structure and component separation methodFUJITSU LTD·Filed 2013·Application pending·0 cites
- 1555US6893512B2Solder alloy and soldered bondFUJITSU LTD·Filed 2003·Granted May 17, 2005·5 cites·3 claims
- 1654US6458946B1Crystals of diuridine tetraphosphate or salt thereof, process for producing the crystals, and process for producing the compoundsYAMASA CORP·Filed 1999·Granted Oct 1, 2002·8 cites·8 claims
- 1754US2018170030A1Electronic apparatus and disassembling method thereforFUJITSU LTD·Filed 2018·Application pending·0 cites
- 1852US2008296266A1Processing apparatusFUJITSU LTD·Filed 2008·Application pending·0 cites
- 1950US2008102294A1Electrically conductive paste and method of making the sameFUJITSU LTD·Filed 2007·Application pending·0 cites
- 2048US5921729ADouble-surface machining systemTOSHIBA KK·Filed 1997·Granted Jul 13, 1999·15 cites·6 claims
- 2148US2010105297A1Polishing apparatusFUJITSU LTD·Filed 2009·Application pending·0 cites
- 2248US2017326864A1Electronic apparatus and disassembling method thereforFUJITSU LTD·Filed 2017·Application pending·0 cites
- 2348US2009044972A1Circuit board, method of forming wiring pattern, and method of manufacturing circuit boardFUJITSU LTD KAWASAKI JAPAN·Filed 2008·Application pending·0 cites
- 2447US7824111B2Optical moduleFUJITSU LTD·Filed 2006·Granted Nov 2, 2010·0 cites·23 claims
- 2547US6744183B2Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding methodFUJITSU LTD·Filed 2003·Granted Jun 1, 2004·2 cites·2 claims
- 2644US7961207B2Image generating apparatusFUNAI ELECTRIC CO·Filed 2007·Granted Jun 14, 2011·0 cites·15 claims
- 2744US2006169750A1Soldering method and apparatusFUJITSU LTD·Filed 2005·Application pending·0 cites
- 2844US2011165319A1Apparatus for forming solder dam and method of forming solder damFUJITSU LTD·Filed 2010·Application pending·0 cites
- 2942US2011163152A1Method of forming solder damFUJITSU LTD·Filed 2010·Application pending·0 cites
- 3041US5671467AColor image-forming apparatus adapted to stabilize contact between endless belt-like photosensitive medium and developing rollerMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Sep 23, 1997·8 cites·2 claims
- 3138US2016224061A1Electrical device and method of producing the sameFUJITSU LTD·Filed 2015·Application pending·0 cites
- 3238US2011165338A1Apparatus for forming solder damFUJITSU LTD·Filed 2010·Application pending·0 cites
- 3337US7456854B2Thermal printerFUNAI ELECTRIC CO·Filed 2006·Granted Nov 25, 2008·0 cites·7 claims
- 3434US6320158B1Method and apparatus of fabricating perforated plateFUJITSU LTD·Filed 1999·Granted Nov 20, 2001·5 cites·9 claims
- 3531US6432806B1Method of forming bumps and template used for forming bumpsFUJITSU LTD·Filed 1999·Granted Aug 13, 2002·2 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →