Inventor · disambiguated record
Yutaka Ohta
Also filed as: OHTA YUTAKA · TADA YASUYUKI
24 granted patents·1 pending application·520 citations·filing 1976–2010
97Inventor score
Files withSHINETSU HANDOTAI KK11MATSUSHITA ELECTRIC INDUSTRIAL CO LTD3HONDA MOTOR CO LTD2DAINICHI NIPPON CABLES LTD1DOWA ELECTRONICS MATERIALS CO LTD1
Top patents by PatentIndex Score
25 records- 0193US6619415B1Cowling unit of motorcycleHONDA MOTOR CO LTD·Filed 2000·Granted Sep 16, 2003·56 cites·16 claims
- 0290US6422182B1Engine cooling apparatusHONDA MOTOR CO LTD·Filed 2000·Granted Jul 23, 2002·37 cites·16 claims
- 0382US4085837AVertical tabulation control for high speed printerNIPPON TELEGRAPH & TELEPHONE·Filed 1976·Granted Apr 25, 1978·21 cites·11 claims
- 0480US5493455ARecording apparatus using a tape cassette with a memoryMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Feb 20, 1996·35 cites·10 claims
- 0577US8330168B2Nitride semiconductor light-emitting element and method of manufacturing the sameOHTA YUTAKA·Filed 2009·Granted Dec 11, 2012·9 cites·6 claims
- 0675US5487358AApparatus for growing silicon epitaxial layerSHINETSU HANDOTAI KK·Filed 1995·Granted Jan 30, 1996·27 cites·4 claims
- 0774US5183783AMethod for production of dielectric-separation substrateSHINETSU HANDOTAI KK·Filed 1991·Granted Feb 2, 1993·52 cites·6 claims
- 0872US5421288AProcess for growing silicon epitaxial layerSHINETSU HANDOTAI KK·Filed 1993·Granted Jun 6, 1995·25 cites·9 claims
- 0972US4255318AFire-retardant putty-like compositionsDAINICHI NIPPON CABLES LTD·Filed 1979·Granted Mar 10, 1981·18 cites·25 claims
- 1067US5427052AMethod and apparatus for production of extremely thin SOI film substrateSHINETSU HANDOTAI KK·Filed 1992·Granted Jun 27, 1995·36 cites·4 claims
- 1162US8860294B2Light emitting element and method for manufacturing the sameTOYOTA TATSUNORI·Filed 2010·Granted Oct 14, 2014·1 cites·4 claims
- 1261US6174740B1Method for analyzing impurities within silicon waferSHINETSU HANDOTAI KK·Filed 1996·Granted Jan 16, 2001·31 cites·3 claims
- 1361US5441571ACylindrical apparatus for growth of epitaxial layersSHINETSU HANDOTAI KK·Filed 1993·Granted Aug 15, 1995·15 cites·2 claims
- 1461US5223080AMethod for controlling thickness of single crystal thin-film layer in soi substrateSHINETSU HANDOTAI KK·Filed 1991·Granted Jun 29, 1993·29 cites·12 claims
- 1557US5376215AApparatus for production of extremely thin SOI film substrateSHINETSU HANDOTAI KK·Filed 1993·Granted Dec 27, 1994·23 cites·3 claims
- 1655US5527612AFluorocarbon copolymer-insulated wireMITSUBISHI CABLE IND LTD·Filed 1994·Granted Jun 18, 1996·19 cites·11 claims
- 1755US5124274AMethod for production of dielectric-separation substrateSHINETSU HANDOTAI KK·Filed 1991·Granted Jun 23, 1992·26 cites·2 claims
- 1847US7800096B2Light emitting semiconductorDOWA ELECTRONICS MATERIALS CO LTD·Filed 2009·Granted Sep 21, 2010·0 cites·19 claims
- 1945US5393370AMethod of making a SOI film having a more uniform thickness in a SOI substrateSHINETSU HANDOTAI KK·Filed 1993·Granted Feb 28, 1995·15 cites·9 claims
- 2045US5336634ADielectrically isolated substrate and a process for producing the sameSHIN ETSU HANDOTUI CO LTD·Filed 1993·Granted Aug 9, 1994·20 cites·5 claims
- 2143US4530001AHigh voltage integrated semiconductor devices using a thermoplastic resin layerOKI ELECTRIC IND CO LTD·Filed 1981·Granted Jul 16, 1985·10 cites·14 claims
- 2240US4182036AOrthodontic unit disposition structureMORITA MFG·Filed 1978·Granted Jan 8, 1980·8 cites·2 claims
- 2336US2001014544A1Semiconductor producing apparatus and producing method for epitaxial wafer using sameSHINETSU HANDOTAI KK·Filed 2001·Application pending·0 cites
- 2435US4609952ARecording and reproducing apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1985·Granted Sep 2, 1986·3 cites·3 claims
- 2533US5282098ACapstan controlling apparatus including capstan, supply side reel and winding side reel rotation detectorsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1991·Granted Jan 25, 1994·4 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →