Inventor · disambiguated record
Yukinobu Ohura
Also filed as: OHURA YUKINOBU
13 granted patents·5 pending applications·6 citations·filing 2012–2024
82Inventor score
Files withDISCO CORP18
Top patents by PatentIndex Score
18 records- 0182US9620355B2Wafer processing methodDISCO CORP·Filed 2016·Granted Apr 11, 2017·4 cites·4 claims
- 0272US9847257B2Laser processing methodDISCO CORP·Filed 2016·Granted Dec 19, 2017·2 cites·8 claims
- 0370US11637033B2Method of manufacturing protective film agentDISCO CORP·Filed 2022·Granted Apr 25, 2023·0 cites·1 claims
- 0460US12368049B2Protective film agent and processing method of workpieceDISCO CORP·Filed 2022·Granted Jul 22, 2025·0 cites·8 claims
- 0557US11322383B2Protective film agent for laser dicingDISCO CORP·Filed 2020·Granted May 3, 2022·0 cites·16 claims
- 0654US2024290624A1Protective film, protective film agent, and method of processing workpieceDISCO CORP·Filed 2024·Application pending·0 cites
- 0753US12476148B2Method of processing waferDISCO CORP·Filed 2022·Granted Nov 18, 2025·0 cites·6 claims
- 0849US10858524B2Protective film forming resin agent and laser processing methodDISCO CORP·Filed 2016·Granted Dec 8, 2020·0 cites·7 claims
- 0942US10086474B2Protective film applying apparatus and protective film applying methodDISCO CORP·Filed 2017·Granted Oct 2, 2018·0 cites·1 claims
- 1042US2014206177A1Wafer processing methodDISCO CORP·Filed 2014·Application pending·0 cites
- 1142US2014175070A1Laser processing method and fine particle layer forming agentDISCO CORP·Filed 2013·Application pending·0 cites
- 1241US10811458B2Method of processing waferDISCO CORP·Filed 2018·Granted Oct 20, 2020·0 cites·17 claims
- 1341US9748119B2Wafer processing methodDISCO CORP·Filed 2016·Granted Aug 29, 2017·0 cites·18 claims
- 1438US2013087947A1Ablation methodDISCO CORP·Filed 2012·Application pending·0 cites
- 1535US9976951B2Protective film detecting methodDISCO CORP·Filed 2016·Granted May 22, 2018·0 cites·7 claims
- 1635US9689798B1Protective film detecting method for laser processingDISCO CORP·Filed 2016·Granted Jun 27, 2017·0 cites·3 claims
- 1735US9613415B2Protective film detecting apparatus and protective film detecting methodDISCO CORP·Filed 2015·Granted Apr 4, 2017·0 cites·4 claims
- 1833US2016307851A1Method of dividing waferDISCO CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →