Inventor · disambiguated record
Yugo Orihashi
Also filed as: ORIHASHI YUGO
20 granted patents·2 pending applications·54 citations·filing 2012–2024
93Inventor score
Technology areasH10P
Top patents by PatentIndex Score
22 records- 0192US9054046B2Method of manufacturing semiconductor device and method of processing substrateHITACHI INT ELECTRIC INC·Filed 2012·Granted Jun 9, 2015·10 cites·20 claims
- 0290US9508543B2Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Nov 29, 2016·10 cites·15 claims
- 0388US9460911B2Method of manufacturing semiconductor device and substrate processing methodHITACHI INT ELECTRIC INC·Filed 2015·Granted Oct 4, 2016·4 cites·10 claims
- 0487US9412587B2Method of manufacturing semiconductor device, substrate processing apparatus, gas supply system, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Aug 9, 2016·4 cites·19 claims
- 0587US9218959B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2013·Granted Dec 22, 2015·6 cites·14 claims
- 0685US9190298B2Film forming method and recording medium for performing the methodHITACHI INT ELECTRIC INC·Filed 2014·Granted Nov 17, 2015·5 cites·16 claims
- 0783US8987146B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2013·Granted Mar 24, 2015·6 cites·19 claims
- 0881US9691609B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Jun 27, 2017·2 cites·20 claims
- 0975US9941119B2Method of forming silicon layer in manufacturing semiconductor device and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Apr 10, 2018·1 cites·18 claims
- 1072US9837261B2Method of manufacturing semiconductor device and substrate processing methodHITACHI INT ELECTRIC INC·Filed 2016·Granted Dec 5, 2017·1 cites·12 claims
- 1170US9997354B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Jun 12, 2018·1 cites·14 claims
- 1269US9460916B2Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted Oct 4, 2016·1 cites·20 claims
- 1368US10090152B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Oct 2, 2018·1 cites·9 claims
- 1468US9520282B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Dec 13, 2016·1 cites·14 claims
- 1563US9899211B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Feb 20, 2018·1 cites·18 claims
- 1661US2025105007A1Substrate processing method, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1756US9540728B2Substrate processing apparatus, apparatus for manufacturing semiconductor device, and gas supply systemHITACHI INT ELECTRIC INC·Filed 2016·Granted Jan 10, 2017·0 cites·20 claims
- 1855US11164744B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Nov 2, 2021·0 cites·18 claims
- 1954US12503762B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Dec 23, 2025·0 cites·23 claims
- 2052US10262857B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Apr 16, 2019·0 cites·9 claims
- 2151US2023295837A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 2242US10134584B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Nov 20, 2018·0 cites·12 claims
Join the waitlist — get patent alerts
Get an alert when Yugo Orihashi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →