Inventor · disambiguated record
Yuji Otsuki
Also filed as: OTSUKI YUJI
1 granted patent·13 pending applications·0 citations·filing 2020–2025
10Inventor score
Top patents by PatentIndex Score
14 records- 0157US2025154643A1Area selective deposition of metals for electronic devicesTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0256US2025067556A1Method of measuring film thickness, and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0356US2024363410A1Methods for making semiconductor devices that include metal cap layersTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0454US2024052483A1Film forming method and film forming apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 0552US11626330B2Film forming method and film forming apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Apr 11, 2023·0 cites·13 claims
- 0652US2025343041A1Substrate-processing method and substrate-processing systemTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 0750US2025067664A1Determination method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 0849US2025179625A1Method of forming silicon nitride film and film forming apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 0945US2024371631A1Film forming method and film forming apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 1044US2024087885A1Method of forming silicon nitride film and film forming apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 1144US2022347125A1Antitumor agent and compounding agentUNIV KEIO·Filed 2020·Application pending·0 cites
- 1238US2025224329A1Substrate evaluation method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1336US2025003874A1Measurement method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 1435US2024321650A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →