Inventor · disambiguated record
Yukifumi Oyama
Also filed as: OYAMA YUKIFUMI
9 granted patents·3 pending applications·23 citations·filing 2007–2020
82Inventor score
Top patents by PatentIndex Score
12 records- 0181US7674651B2Mounting method for semiconductor parts on circuit substrateIBM·Filed 2007·Granted Mar 9, 2010·13 cites·1 claims
- 0274US10600773B2Semiconductor device manufacturing methodTOSHIBA MEMORY CORP·Filed 2017·Granted Mar 24, 2020·2 cites·13 claims
- 0374US9448065B2Manufacturing method of semiconductor device and semiconductor manufacturing apparatusTOSHIBA KK·Filed 2015·Granted Sep 20, 2016·3 cites·16 claims
- 0469US10607964B2Semiconductor deviceTOSHIBA MEMORY CORP·Filed 2016·Granted Mar 31, 2020·2 cites·20 claims
- 0567US10854576B2Semiconductor device and manufacturing method thereofTOSHIBA MEMORY CORP·Filed 2017·Granted Dec 1, 2020·1 cites·13 claims
- 0666US9570414B2Semiconductor device and method of manufacturing the semiconductor deviceTOSHIBA KK·Filed 2014·Granted Feb 14, 2017·2 cites·17 claims
- 0761US10903200B2Semiconductor device manufacturing methodTOSHIBA MEMORY CORP·Filed 2020·Granted Jan 26, 2021·0 cites·15 claims
- 0849US2015069110A1Semiconductor manufacturing apparatusTOSHIBA KK·Filed 2014·Application pending·0 cites
- 0948US11688678B2Wiring board and semiconductor deviceKIOXIA CORP·Filed 2020·Granted Jun 27, 2023·0 cites·17 claims
- 1044US2016111317A1Semiconductor manufacturing apparatusTOSHIBA KK·Filed 2015·Application pending·0 cites
- 1142US7682936B2Reduction in thickness of semiconductor component on substrateIBM·Filed 2007·Granted Mar 23, 2010·0 cites·13 claims
- 1241US2015069634A1Semiconductor deviceTOSHIBA KK·Filed 2014·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yukifumi Oyama files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →