Inventor · disambiguated record
Yukio Ozaki
Also filed as: OZAKI YUKIO
29 granted patents·13 pending applications·662 citations·filing 1977–2019
97Inventor score
Files withFUJITSU LTD20PIONEER ELECTRONIC CORP4OZAKI YUKIO3HITACHI INT ELECTRIC INC2MITSUBISHI ELECTRIC CORP2
Top patents by PatentIndex Score
42 records- 0195US8443484B2Substrate processing apparatusOZAKI YUKIO·Filed 2008·Granted May 21, 2013·327 cites·9 claims
- 0288US4199721AHand-held microphone for transceiverNIPPON ATSUDENKI KK·Filed 1977·Granted Apr 22, 1980·49 cites·13 claims
- 0383US5054886ALens framePIONEER ELECTRIC CORP·Filed 1990·Granted Oct 8, 1991·61 cites·7 claims
- 0482US9649930B2Fuel inletFUTABA IND CO LTD·Filed 2013·Granted May 16, 2017·7 cites·8 claims
- 0581US7509103B2Digital radio broadcasting receiver and method of receiving digital radio broadcastingTOSHIBA KK·Filed 2005·Granted Mar 24, 2009·6 cites·5 claims
- 0680US7595582B2Resonator, ultrasonic die bonding head, and ultrasonic die bonding apparatusFUJITSU LTD·Filed 2005·Granted Sep 29, 2009·9 cites·9 claims
- 0780US7233453B2Servo track writing device and method thereofFUJITSU LTD·Filed 2003·Granted Jun 19, 2007·17 cites·42 claims
- 0876US7566586B2Method of manufacturing a semiconductor deviceFUJITSU LTD·Filed 2006·Granted Jul 28, 2009·7 cites·11 claims
- 0976US6760180B2Servo track writer and driving method thereforFUJITSU LTD·Filed 2001·Granted Jul 6, 2004·16 cites·13 claims
- 1072US9349501B2Gas insulated switchgear and manufacturing method of the sameMIYAMOTO TAKASHI·Filed 2012·Granted May 24, 2016·7 cites·13 claims
- 1168US4198601AControl unit for transceiverNIPPON ATSUDENKI K K T A JAPAN·Filed 1977·Granted Apr 15, 1980·23 cites·16 claims
- 1267US7905268B2Ultrasonic bonding apparatusFUJITSU LTD·Filed 2009·Granted Mar 15, 2011·2 cites·4 claims
- 1367US7264146B2Ultrasonic tool and ultrasonic bonderFUJITSU LTD·Filed 2004·Granted Sep 4, 2007·9 cites·16 claims
- 1466US5408282AProjection system for projection TV setPIONEER ELECTRONIC CORP·Filed 1993·Granted Apr 18, 1995·29 cites·20 claims
- 1562US6342547B1Epoxy resin composition for SF6 gas insulating device and SF6 gas insulating deviceMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jan 29, 2002·6 cites·16 claims
- 1660US7218030B2Oscillating apparatusFUJITSU LTD·Filed 2005·Granted May 15, 2007·3 cites·7 claims
- 1759US7823618B2Ultrasonic bonding apparatusFUJITSU LTD·Filed 2009·Granted Nov 2, 2010·2 cites·20 claims
- 1858US8904955B2Substrate processing apparatusNOMURA MAKOTO·Filed 2009·Granted Dec 9, 2014·1 cites·15 claims
- 1957US2008048003A1Resonator, ultrasonic head, and ultrasonic bonder using the sameFUJITSU LTD·Filed 2007·Application pending·0 cites
- 2057US2008048004A1Resonator, ultrasonic head, and ultrasonic bonder using the sameFUJITSU LTD·Filed 2007·Application pending·0 cites
- 2155US7938160B2Ultrasonic bonding apparatusFUJITSU LTD·Filed 2009·Granted May 10, 2011·1 cites·9 claims
- 2255US2006231592A1Ultrasonic tool and ultrasonic bonderFUJITSU LTD·Filed 2006·Application pending·0 cites
- 2354US2019266547A1Information processing device, non-transitory computer readable storage medium and work plan editing support methodFUJITSU LTD·Filed 2019·Application pending·0 cites
- 2453US9437465B2Substrate processing apparatus and method of manufacturing semiconductor deviceTAKAHATA SATORU·Filed 2009·Granted Sep 6, 2016·1 cites·17 claims
- 2553US2010055808A1Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2009·Application pending·0 cites
- 2651US4948226ALens alignment apparatus for use in a projection televisionPIONEER ELECTRONIC CORP·Filed 1989·Granted Aug 14, 1990·14 cites·3 claims
- 2750US2006113350A1Resonator, ultrasonic head, and ultrasonic bonder using the sameOZAKI YUKIO·Filed 2005·Application pending·0 cites
- 2850US2018276590A1Non-transitory computer-readable storage medium, process planning method, and process planning deviceFUJITSU LTD·Filed 2018·Application pending·0 cites
- 2949US10712725B2Non-transitory computer-readable storage medium, robot transfer time estimation method, and robot transfer time estimation deviceFUJITSU LTD·Filed 2018·Granted Jul 14, 2020·0 cites·7 claims
- 3048US4638945ANozzle for the gunning of monolithic refractoriesSHINAGAWA REFRACTORIES CO·Filed 1985·Granted Jan 27, 1987·16 cites·1 claims
- 3148US2008087708A1Resonator, ultrasonic die bonding head, and ultrasonic die bonding apparatusFUJITSU LTD·Filed 2007·Application pending·0 cites
- 3246US2011240059A1Cleaning apparatus and methodFUJITSU LTD·Filed 2011·Application pending·0 cites
- 3346US2006097029A1Method of flip-chip bondingFUJITSU LTD·Filed 2005·Application pending·0 cites
- 3445US5028883ATone controller for attenuating noise in the signal generated by receiver from weak electric field, and receiver having the tone controllerTOSHIBA KK·Filed 1989·Granted Jul 2, 1991·7 cites·7 claims
- 3545US2006113351A1Ultrasonic headFUJITSU LTD·Filed 2005·Application pending·0 cites
- 3644US2015371914A1Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2015·Application pending·0 cites
- 3743US6254479B1Game machineKONAMI CO LTD·Filed 1999·Granted Jul 3, 2001·23 cites·23 claims
- 3842US5625496ALens for projection televisionPIONEER ELECTRONIC CORP·Filed 1995·Granted Apr 29, 1997·10 cites·11 claims
- 3939US5010396ATelevision projector for projection displayPIONEER ELECTRONIC CORP·Filed 1990·Granted Apr 23, 1991·8 cites·6 claims
- 4035US2010174398A1Position measuring apparatus and coating apparatusFUJITSU LTD·Filed 2010·Application pending·0 cites
- 4131US8457774B2Substrate processing apparatus, control method of the substrate processing apparatus, manufacturing method of semiconductor device and apparatus state shifting methodOZAKI YUKIO·Filed 2010·Granted Jun 4, 2013·0 cites·3 claims
- 4223US4618752AGas-insulated interrupterMITSUBISHI ELECTRIC CORP·Filed 1985·Granted Oct 21, 1986·1 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →