Inventor · disambiguated record
Yukinori Sakiyama
Also filed as: SAKIYAMA I YUKINORI · SAKIYAMA YUKINORI
21 granted patents·17 pending applications·120 citations·filing 2012–2024
94Inventor score
Top patents by PatentIndex Score
38 records- 0198US9508547B1Composition-matched curtain gas mixtures for edge uniformity modulation in large-volume ALD reactorsLAM RES CORP·Filed 2015·Granted Nov 29, 2016·31 cites·20 claims
- 0297US11823928B2Control of wafer bow in multiple stationsLAM RES CORP·Filed 2021·Granted Nov 21, 2023·4 cites·20 claims
- 0396US10553465B2Control of water bow in multiple stationsLAM RES CORP·Filed 2017·Granted Feb 4, 2020·18 cites·16 claims
- 0496US9644271B1Systems and methods for using electrical asymmetry effect to control plasma process space in semiconductor fabricationLAM RES CORP·Filed 2016·Granted May 9, 2017·21 cites·24 claims
- 0595US10378107B2Low volume showerhead with faceplate holes for improved flow uniformityLAM RES CORP·Filed 2015·Granted Aug 13, 2019·11 cites·26 claims
- 0694US10128160B2Systems and methods for detection of plasma instability by electrical measurementLAM RES CORP·Filed 2017·Granted Nov 13, 2018·6 cites·20 claims
- 0794US10121708B2Systems and methods for detection of plasma instability by optical diagnosisLAM RES CORP·Filed 2016·Granted Nov 6, 2018·7 cites·17 claims
- 0893US11183406B2Control of wafer bow in multiple stationsLAM RES CORP·Filed 2019·Granted Nov 23, 2021·7 cites·24 claims
- 0987US11393729B2Systems and methods for controlling plasma instability in semiconductor fabricationLAM RES CORP·Filed 2019·Granted Jul 19, 2022·2 cites·20 claims
- 1087US9824941B2Systems and methods for detection of plasma instability by electrical measurementLAM RES CORP·Filed 2016·Granted Nov 21, 2017·3 cites·21 claims
- 1183US10510625B2Systems and methods for controlling plasma instability in semiconductor fabricationLAM RES CORP·Filed 2016·Granted Dec 17, 2019·2 cites·20 claims
- 1283US9997422B2Systems and methods for frequency modulation of radiofrequency power supply for controlling plasma instabilityLAM RES CORP·Filed 2016·Granted Jun 12, 2018·2 cites·20 claims
- 1380US2024055285A1Control of wafer bow in multiple stationsLAM RES CORP·Filed 2023·Application pending·0 cites
- 1479US12322582B2Anomalous plasma event detection and mitigation in semiconductor processingLAM RES CORP·Filed 2020·Granted Jun 3, 2025·1 cites·19 claims
- 1579US10622243B2Planar substrate edge contact with open volume equalization pathways and side containmentLAM RES CORP·Filed 2017·Granted Apr 14, 2020·2 cites·19 claims
- 1678US2024355600A1Anomalous plasma event detection and mitigation in semiconductor processingLAM RES CORP·Filed 2024·Application pending·0 cites
- 1777US2023416922A1Tool for preventing or suppressing arcingLAM RES CORP·Filed 2023·Application pending·0 cites
- 1876US10475627B2Carrier ring wall for reduction of back-diffusion of reactive species and suppression of local parasitic plasma ignitionLAM RES CORP·Filed 2016·Granted Nov 12, 2019·3 cites·18 claims
- 1975US2023246624A1Systems and methods for providing shunt cancellation of parasitic components in a plasma reactorLAM RES CORP·Filed 2023·Application pending·0 cites
- 2068US2020048770A1Chemical vapor deposition tool for preventing or suppressing arcingLAM RES CORP·Filed 2018·Application pending·0 cites
- 2163US11443975B2Planar substrate edge contact with open volume equalization pathways and side containmentLAM RES CORP·Filed 2020·Granted Sep 13, 2022·0 cites·24 claims
- 2253US9941113B2Systems and methods for using electrical asymmetry effect to control plasma process space in semiconductor fabricationLAM RES CORP·Filed 2017·Granted Apr 10, 2018·0 cites·24 claims
- 2353US2024410760A1Thermal imaging for analysis of device fabrication toolsLAM RES CORP·Filed 2022·Application pending·0 cites
- 2453US2025132132A1Electrode-dielectric nozzle for plasma processingLAM RES CORP·Filed 2022·Application pending·0 cites
- 2552US2025372357A1Parasitic plasma suppressorLAM RES CORP·Filed 2023·Application pending·0 cites
- 2651US9875883B2Metrology methods to detect plasma in wafer cavity and use of the metrology for station-to-station and tool-to-tool matchingLAM RES CORP·Filed 2017·Granted Jan 23, 2018·0 cites·18 claims
- 2751US2022119954A1Substrate processing tool capable of modulating one or more plasma temporally and/or spatiallyLAM RES CORP·Filed 2020·Application pending·0 cites
- 2851US2018175819A1Systems and methods for providing shunt cancellation of parasitic components in a plasma reactorLAM RES CORP·Filed 2016·Application pending·0 cites
- 2951US2025038034A1Method and apparatus for radio frequency grid design in an esc to reduce film asymmetryLAM RES CORP·Filed 2023·Application pending·0 cites
- 3051US2024234112A1Image analysis of plasma conditionsLAM RES CORP·Filed 2022·Application pending·0 cites
- 3150US2023207274A1Photoelectron assisted plasma ignitionLAM RES CORP·Filed 2021·Application pending·0 cites
- 3248US12340992B2Detection and location of anomalous plasma events in fabrication chambersLAM RES CORP·Filed 2020·Granted Jun 24, 2025·0 cites·25 claims
- 3348US9754769B2Metrology methods to detect plasma in wafer cavity and use of the metrology for station-to-station and tool-to-tool matchingLAM RES CORP·Filed 2015·Granted Sep 5, 2017·0 cites·18 claims
- 3448US2023369091A1High temperature pedestal with extended electrostatic chuck electrodeLAM RES CORP·Filed 2021·Application pending·0 cites
- 3546US2025104982A1Monitoring and control of plasma-based processesLAM RES CORP·Filed 2022·Application pending·0 cites
- 3643US2015004248A1Method and device for generating a non-thermal plasma having a predetermined ozone concentrationMAX PLANCK GES ZUR FÖRDERUNG DER WISSENSCHAFTEN E V·Filed 2012·Application pending·0 cites
- 3737US10301718B2Asymmetric pedestal/carrier ring arrangement for edge impedance modulationLAM RES CORP·Filed 2016·Granted May 28, 2019·0 cites·15 claims
- 3833US2016289827A1Plasma processing systems and structures having sloped confinement ringsLAM RES CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →