Inventor · disambiguated record
Yu-Chi Shen
Also filed as: SHEN YU-CHI
2 granted patents·0 citations·filing 2019–2021
26Inventor score
Files withUNIMICRON TECHNOLOGY CORP2
Top patents by PatentIndex Score
2 records- 0164US11562972B2Manufacturing method of the chip package structure having at least one chip and at least one thermally conductive elementUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Jan 24, 2023·0 cites·10 claims
- 0253US11145610B2Chip package structure having at least one chip and at least one thermally conductive element and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Oct 12, 2021·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →