Inventor · disambiguated record
Yuta Shimazaki
Also filed as: SHIMAZAKI YUTA
7 granted patents·12 pending applications·3 citations·filing 2010–2023
70Inventor score
Top patents by PatentIndex Score
19 records- 0187US11760066B2Method for protecting Low-E glass plate, method for producing glass unit, laminate and protective sheet for Low-E glass plateNITTO DENKO CORP·Filed 2020·Granted Sep 19, 2023·3 cites·10 claims
- 0261US12247148B2Method for protecting low-E glass plate, method for producing glass unit and protective sheet for low-E glass plateNITTO DENKO CORP·Filed 2021·Granted Mar 11, 2025·0 cites·18 claims
- 0359US12291660B2Method for preparing pressure-sensitive adhesive composition, method for producing protective sheet and method for producing glass unitNITTO DENKO CORP·Filed 2019·Granted May 6, 2025·0 cites·18 claims
- 0458US2025076858A1Anomaly determination method and production management systemPANASONIC IP MAN CO LTD·Filed 2023·Application pending·0 cites
- 0557US12017950B2Low-E glass plate, protective sheet for low-E glass plate and use thereofNITTO DENKO CORP·Filed 2020·Granted Jun 25, 2024·0 cites·12 claims
- 0656US12358263B2Method for protecting low-E glass plate, method for producing glass unit, laminate and protective sheet for low-E glass plateNITTO DENKO CORP·Filed 2020·Granted Jul 15, 2025·0 cites·20 claims
- 0756US2025103991A1Anomaly determination method and production management systemPANASONIC IP MAN CO LTD·Filed 2023·Application pending·0 cites
- 0855US12319854B2Protective sheetNITTO DENKO CORP·Filed 2019·Granted Jun 3, 2025·0 cites·20 claims
- 0954US2023081331A1Pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2021·Application pending·0 cites
- 1049US2023106962A1Skill evaluation device and skill evaluation methodPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 1149US2021114360A1Heat-shielding heat insulating substrateNITTO DENKO CORP·Filed 2018·Application pending·0 cites
- 1249US2023384759A1Information processing method and information processing devicePANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 1341US2013034737A1Production method of cured multilayer sheet and cured multilayer sheetNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 1436US2012156483A1Ashesive tape or sheet, and base material thereforSHIMAZAKI YUTA·Filed 2010·Application pending·0 cites
- 1535US8546958B2Pressure-sensitive adhesive sheet for protecting semiconductor waferHABU TAKASHI·Filed 2011·Granted Oct 1, 2013·0 cites·5 claims
- 1634US2012058319A1Pressure-sensitive adhesive sheet for protecting semiconductor waferYAMAMOTO AKIYOSHI·Filed 2011·Application pending·0 cites
- 1732US2012058336A1Temporary fixing sheet for manufacturing process of electronic partsSHIMOKAWA DAISUKE·Filed 2011·Application pending·0 cites
- 1832US2012059124A1Temporary fixing sheetSHIMAZAKI YUTA·Filed 2011·Application pending·0 cites
- 1929US2012065350A1Viscoelastic body and method for manufacturing the sameHABU TAKASHI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →