Inventor · disambiguated record
Yukihiro Shimogaki
Also filed as: SHIMOGAKI YUKIHIRO
8 granted patents·4 pending applications·35 citations·filing 2002–2025
81Inventor score
Top patents by PatentIndex Score
12 records- 0175US7105060B2Method of forming an oxidation-resistant TiSiN filmTOKYO ELECTRON LTD·Filed 2004·Granted Sep 12, 2006·16 cites·4 claims
- 0275US6793969B2Method of forming an oxidation-resistant TiSiN filmTOKYO ELECTRON LTD·Filed 2002·Granted Sep 21, 2004·16 cites·13 claims
- 0375US2025369116A1Film deposition method by atomic layer depositionDAIKIN IND LTD·Filed 2025·Application pending·0 cites
- 0471US9822445B2Method for manufacturing heat-resistant composite materialIHI CORP·Filed 2015·Granted Nov 21, 2017·1 cites·14 claims
- 0570US10221104B2Heat-resistant composite material production method and production deviceIHI CORP·Filed 2016·Granted Mar 5, 2019·1 cites·19 claims
- 0664US2024417333A1Method for covering fiber bodyIHI CORP·Filed 2024·Application pending·0 cites
- 0763US10167549B2Heat-resistant composite material production method and production deviceIHI CORP·Filed 2016·Granted Jan 1, 2019·1 cites·15 claims
- 0860US12000034B2Coated toolKYOCERA CORP·Filed 2021·Granted Jun 4, 2024·0 cites·14 claims
- 0960US11229893B2Method of producing a silicon compound material and apparatus for producing a silicon compound materialIHI CORP·Filed 2019·Granted Jan 25, 2022·0 cites·29 claims
- 1057US12427581B2Coated toolKYOCERA CORP·Filed 2021·Granted Sep 30, 2025·0 cites·3 claims
- 1143US2011012178A1Semiconductor wafer, method of manufacturing a semiconductor wafer, and semiconductor deviceSUGIYAMA MASAKAZU·Filed 2009·Application pending·0 cites
- 1237US2011129686A1Deposition method, deposition apparatus, and laminated filmDENSO CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →