Inventor · disambiguated record
Yuichiro Shishido
Also filed as: SHISHIDO YUICHIRO
4 granted patents·11 pending applications·9 citations·filing 2010–2023
66Inventor score
Top patents by PatentIndex Score
15 records- 0171US8779586B2Die bond film, dicing die bond film, and semiconductor deviceOONISHI KENJI·Filed 2011·Granted Jul 15, 2014·4 cites·15 claims
- 0271US8614139B2Dicing film with protecting filmSHISHIDO YUICHIRO·Filed 2012·Granted Dec 24, 2013·4 cites·2 claims
- 0359US9105754B2Adhesive film, method of manufacturing semiconductor device, and semiconductor deviceNITTO DENKO CORP·Filed 2013·Granted Aug 11, 2015·1 cites·10 claims
- 0453US2025157975A1Semiconductor device and method for producing semiconductor deviceNITTO DENKO CORP·Filed 2023·Application pending·0 cites
- 0553US2024409786A1Protective sheet, method for producing electronic component, and method for producing glass piece forming display surface of display apparatusNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 0653US2025219004A1Connecting structureNITTO DENKO CORP·Filed 2023·Application pending·0 cites
- 0748US2014106106A1Dicing film with protecting filmNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 0846US2023125153A1Bonding sheetNITTO DENKO CORP·Filed 2021·Application pending·0 cites
- 0937US8658515B2Method of manufacturing film for semiconductor deviceINOUE KOICHI·Filed 2012·Granted Feb 25, 2014·0 cites·7 claims
- 1037US2011084408A1Thermosetting die-bonding filmSHISHIDO YUICHIRO·Filed 2010·Application pending·0 cites
- 1137US2011084413A1Thermosetting die-bonding filmSHISHIDO YUICHIRO·Filed 2010·Application pending·0 cites
- 1235US2017140972A1Laminated body and semiconductor device manufacturing methodNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 1335US2011190421A1Adhesive composition for producing semiconductor device, and adhesive sheet for producing semiconductor deviceKIMURA YUTA·Filed 2011·Application pending·0 cites
- 1431US2011217501A1Dicing die-bonding filmSHISHIDO YUICHIRO·Filed 2011·Application pending·0 cites
- 1530US2014083760A1Method for production of sealed body, frame-shaped spacer for production of sealed body, sealed body and electronic instrumentNITTO DENKO CORP·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →